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Cover tape for packaging electronic parts and method for preparing the cover tape

A technology for packaging electronics and components, applied in electrical components, electrical components, etc., can solve the problems of uneven peel strength, no conventional cover tape, high cost, etc., and achieve the effect of excellent work efficiency

Active Publication Date: 2010-09-08
YOULCHON CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a cover tape for encapsulating electronic components and a method for producing the cover tape, wherein the cover tape has excellent properties such as heat-sealability, peel strength, Anti-blocking, haze, etc., and thus have excellent working efficiency without the problems of conventional cover tapes and methods of making the same: high cost, fish-eye phenomenon caused by insufficient mixing and melting with additives, Uneven peel strength, property change over time, delamination, high haze, etc.

Method used

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  • Cover tape for packaging electronic parts and method for preparing the cover tape
  • Cover tape for packaging electronic parts and method for preparing the cover tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] A heat sealant using SEBS dissolved in toluene solvent was gravure-coated onto a cover tape (PET film + acrylic adhesive (Product 9600 by Sungdo Chemical, Co., Ltd) + LLDPE film) 3 times, wherein the coating thickness The first time is 5 μm, the second time is 5 μm, and the third time is 5 μm.

Embodiment 2

[0075] Gravure coating was performed three times in the same manner as in Example 1, wherein the coating thickness was 4 μm for the first time, 3 μm for the second time, and 3 μm for the third time.

Embodiment 3

[0077] Gravure coating was performed twice in the same manner as in Example 1, wherein the coating thickness was 5 μm for the first time and 5 μm for the second time.

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PUM

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Abstract

Disclosed are a cover tape for packaging electronic parts comprising heat-seal layer formed by gravure-coating and a method for preparing the cover tape. The cover tape according to the present invention is excellent in heat-seal property, peel-off strength, anti-blocking property, haze, etc. and to this end also in work efficiency.

Description

technical field [0001] The invention relates to a cover tape for packaging electronic components and a method for preparing the cover tape. In particular, the present invention relates to a cover tape for encapsulating electronic components and a method of producing the cover tape, wherein the cover tape has a uniform heat-sealing layer formed by gravure coating (gravure printing). Background technique [0002] Small-sized electronic components such as transistors, capacitors and diodes are transported on carrier tape and heat-sealed with cover tape. When the electronic components are removed from the carrier tape after transfer, the cover tape is peeled off from the carrier tape. [0003] The cover tape should have required properties such as low-temperature heat-sealability, anti-adhesion and low haze properties to be suitable for encapsulating electronic components. In particular, the cover tape needs to have uniform peel strength, because non-uniform peel strength may ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02
CPCH05K13/0084
Inventor 韩喜植金永熙金宪戊闵盛基朴宽荣
Owner YOULCHON CHEM
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