Encapsulation of electronic card

An encapsulation method and electronic card technology, applied in the coating and other directions, can solve the problems of multiple encapsulation steps, complicated processes, depression and deformation of the electronic card, etc., and achieve the effect of reducing costs and strengthening the structure.

Inactive Publication Date: 2008-04-02
3 VIEW TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To solve the defects of multiple packaging steps in the prior art, complicated processes, consuming production time, manpower and manufacturing costs
It further improves the problem that the electronic card in the prior art is easy to be dented, deformed or broken due to external force or bending force

Method used

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  • Encapsulation of electronic card
  • Encapsulation of electronic card
  • Encapsulation of electronic card

Examples

Experimental program
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Embodiment Construction

[0041] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the description in the following paragraphs. It should be understood that the present invention can have various changes in different ways, all of which do not depart from the scope of the present invention, and the description and drawings therein are used as illustrations in nature, not to limit the scope of the present invention .

[0042] The electronic card packaging method of the present invention is mainly applied to the packaging process of small electronic cards, such as: secure digital memory cards, multimedia memory cards or smaller memory cards, of course, common electronic cards on the market, such as: data cards, The technology of the present invention can also be applied to network cards and other memory cards, etc.

[0043] Please refer to FIG. 2a-FIG. 2e, which are schematic diagrams of the packaging process of the electronic card acco...

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PUM

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Abstract

The present invention relates to a package approach of an electronic card which comprises at least the steps of that: (a) an injection molding equipment is provided with a plurality of molds, wherein at least one mold is arranged on a transmission vector of the injection molding equipment; (b) a first shell is formed on the mold of the transmission vector; (c) a coated component is placed in the first shell, and (d) a second shell is formed on the coated component, so that a package component is formed by the first shell, the coated component and the second shell. The present invention of the electronic card packaging method can reduce cost and strengthen the structure.

Description

technical field [0001] The invention relates to a packaging method for an electronic card, in particular to a packaging method for a small electronic card. Background technique [0002] Currently common electronic cards are widely used and tend to be miniaturized gradually, such as data cards (Modem Cards), network cards (Local Area Network Cards, LAN Cards), memory cards (Memory Cards) and so on. Common international standard specifications for electronic cards include PCMCIA cards, Compact Flash Cards (CF Cards), Multimedia Memory Cards (MMC Cards), and Secure Digital Memory Cards (Secure Digital Memory Cards, SD Cards). New specification standards are also constantly being developed. Although the specifications and details of these electronic cards are different, their packaging methods and structures are similar. [0003] Generally speaking, the packaging of electronic cards must provide sufficient mechanical strength and electrical performance, and must at least meet ...

Claims

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Application Information

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IPC IPC(8): B29C45/14B29C45/16B29C45/10B29C45/17B29C45/40
Inventor 王珏泓
Owner 3 VIEW TECH
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