Decompression drying device

Abstract

The invention provides a pressure-reduction drying device which achieves the transportation in and out of a processed substrate effectively, safely and stably and restrains the transfer-printing trace adhered on the substrate contact part of a coating film of the substrate minimally. The pressure-reduction drying device (VD) (46) roll-transports the substrate G to be pressure-reduced and dried into a cavity (106) through the roll-transportation carried out on a transportation-in side roll-transportation channel (104a) and an inner roll-transportation channel (104b); and transports the substrate G which is pressure-reduced and dried out from the cavity (106) through the roll-transportation carried out on an inner roll-transportation channel (104b) and a transportation-out side roll-transportation channel (104c). During the pressure-reduction drying process, the substrate G is maintained in a horizontal state and lifted upwards from the inner roll-transportation channel (104b) through aplurality of lifting pins (128), and the substrate G is supported by the superfine pin tip part of the lifting pin.

Description

technical field [0001] The present invention relates to a reduced-pressure drying device for drying a coating liquid coated on a substrate to be processed under reduced pressure. Background technique [0002] For example, in the photolithography process of flat panel display (FPD) manufacturing such as liquid crystal display (LCD), this kind of reduced pressure drying device is used for pre-preparing the resist solution coated on the substrate to be processed (glass substrate, etc.). Baked and allowed to dry. [0003] For example, as described in Patent Document 1, the decompression drying device of the prior art includes: a lower chamber of a bracket or a shallow container type with an upper opening; The lid-shaped upper chamber formed by fitting. A stage (stage) is arranged in the lower chamber, and after the substrate is horizontally placed on the stage, the chamber is closed (the upper chamber is brought into close contact with the lower chamber), and a reduced-pressur...

AI Technical Summary

Problems solved by technology

[0005] As mentioned above, the conventional reduced-pressure drying apparatus needs to move the upper chamber up and down (open and close) every time the substrate is carried in and out of the chamber. Many bad things happen in

That is, if the size of the substrate is more than 2m on one side like the LCD substrate, the chamber will also be significantly enlarged, and only the upper chamber will weigh more than 2 tons, so a large lifting mechanism is required. Dust generation problems and worker safety issues caused by large vibrations become apparent

In addition, transport machinery and equipment have become larger and larger, but it is difficult to hold and transport large substrates horizontally, and the substrate after resist coating is transported in a curved state like a large fan, so it is easy to cause pressure reduction. Problems such as displacement, collision, or damage of substrates in the chamber of the drying device when they are moved in and out or loaded / unloaded

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