Film for semiconductor device and semiconductor device

A semiconductor and thin-film technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as decreased peelability and decreased retention of semiconductor wafers

Active Publication Date: 2013-05-01
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the fluidity of the adhesive layer or the holding force to the semiconductor wafer is reduced, and the peelability after dicing is reduced.

Method used

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  • Film for semiconductor device and semiconductor device
  • Film for semiconductor device and semiconductor device
  • Film for semiconductor device and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0131] (Preparation of adhesive layer for dicing film)

[0132] Add 76 parts of 2-ethylhexyl acrylate (2EHA), 24 parts of 2-hydroxyethyl acrylate (HEA) and 0.2 parts of benzene peroxide into a reaction vessel with a condenser tube, nitrogen introduction tube, thermometer and stirring device Formyl and 60 parts of toluene were polymerized at 61° C. for 6 hours in a nitrogen stream to obtain an acrylic polymer A with a weight average molecular weight of 750,000. The molar ratio of 2EHA to HEA is 100 moles to 20 moles. The measurement of the weight average molecular weight is as described above.

[0133] 10 parts (80 mol % with respect to HEA) of 2-methacryloyloxyethyl isocyanate (hereinafter referred to as "MOI") was added to this acrylic polymer A, and the addition was carried out at 50°C for 48 hours in an air stream. Reaction treatment to obtain acrylic polymer A'.

[0134]Then, to 100 parts of acrylic polymer A', add 6 parts of isocyanate crosslinking agent (trade name "C...

Embodiment 2）

[0150]

[0151] As the dicing film of this example, the same dicing film as in Example 1 was used except that a 100 μm polyolefin film (substrate) was attached to the adhesive layer.

[0152]

[0153] With respect to 100 parts of an acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., trade name: パラクロン W-197CM, Tg: 18°C, weight average molecular weight: 400,000), 434 parts of epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name: EOCN-1027), 466 parts of phenolic resin (manufactured by Mitsui Chemicals Co., Ltd., Milex XLC-4L), and 1500 parts of spherical silica as an inorganic filler (manufactured by Admatechs Co., Ltd., trade name: SO-25R, average particle diameter: 0.5 μm) and 3 parts of curing catalyst (manufactured by Shikoku Kasei Co., Ltd., C11-Z) were dissolved in methyl ethyl ketone and adjusted to a concentration of 20% by weight. In addition, the tensile storage modulus of the adhesiv...

Embodiment 3）

[0160]

[0161] In the dicing film of this example, in addition to using an adhesive tape base material (thickness 100 μm) containing only random polypropylene resin (MFR: 2 g / 10 minutes, ethylene content: 60 wt %) as the adhesive layer, using The same cutting film as in Example 1. In addition, corona treatment was given to one surface of the adhesive tape base material. Then, a polyolefin film (substrate) having a thickness of 100 μm was pasted on the surface of the pressure-sensitive adhesive layer. Then, it was kept at 50° C. for 24 hours.

[0162]

[0163] For 100 parts of acrylic rubber (manufactured by Nagase Sangyo Co., Ltd., trade name: SG-708-6), 434 parts of epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name: EOCN-1027), 466 parts of phenolic Resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.), 429 parts of spherical silica (manufactured by Admatechs Co., Ltd., trade name: SO-25R, average particle size: 0.5 μm) as an inorganic filler w...

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Abstract

Provided is an adhesive film with a dicing sheet (1), wherein the adhesive film (12) is laminated on top of a dicing film (11), which has excellent reliability and is readily capable of tip protrusion (tongue protrusion) of a cover film (2) while maintaining a function for suppressing the formation of transfer marks when a film (10) for a semiconductor device, wherein the adhesive film with the dicing sheet is laminated at prescribed intervals on the cover film, is wound into a roll. The film for a semiconductor device of the present invention is a film for a semiconductor device wherein the adhesive film with a dicing sheet, which is the adhesive film laminated on top of a dicing film, is laminated to the cover film at prescribed intervals, and said film for a semiconductor device has an Ea/Eb ratio between the tensile storage modulus (Ea) for the dicing film at 23 DEG C and the tensile storage modulus (Eb) for the cover film at 23 DEG C of 0.001-100.

Description

technical field [0001] The present invention relates to a thin film for a semiconductor device and a semiconductor device manufactured using the thin film for a semiconductor device. Background technique [0002] Conventionally, in the manufacturing process of a semiconductor device, silver paste is used when fixing a semiconductor chip to a lead frame or an electrode member. The fixing process is performed by applying a paste-like adhesive on a die pad of a lead frame, etc., mounting a semiconductor chip thereon, and curing the paste-like adhesive layer. [0003] However, the slurry adhesive has large variations in coating amount, coating shape, etc. due to its viscosity behavior, deterioration, and the like. As a result, the thickness of the formed paste-like adhesive is not uniform, and thus the fixing strength of the semiconductor chip lacks reliability. That is, when the application amount of the paste-like adhesive is insufficient, the fixing strength between the sem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301C09J7/02C09J201/00H01L21/52C09J7/30C09J7/22
CPCH01L2924/0002H01L23/293C09J7/02C09J201/00C09J2203/326C09J7/0239H01L21/52C09J7/22C09J7/30H01L2924/00H01L21/48
Inventor 天野康弘木村雄大
Owner NITTO DENKO CORP
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