Substrate transfer apparatus and substrate transfer method

Abstract

The invention provides a substrate transfer apparatus and a substrate transfer method, capable of transferring the substrate out from a floating stand without stopping the transfer of the substrate and preventing a transfer printing mark on a surface to be processed from being generated and increasing the production performance. The substrate transfer apparatus comprises a floating transfer part for transferring the substrate (G) at the floating state and a rolling transfer part (2B) arranged at the back segment of the floating transfer part and obtaining the substrate from the floating transfer part by a transfer roller. The floating transfer part comprises: a floating stand (3) for floating the substrate; guide rails (5) arranged in parallel with the left, right sides of the floating stand and extending to the left, right sides of the rolling transfer part; and a substrate carrier (6) respectively movably arranged along the guide rails and capable of absorbing and keeping the substrate from below, wherein the substrate is absorbed and kept by the substrate carrier and transferred along the guide rail and when the front end of the substrate arrives at the preset position of the rolling transfer part, the absorption of the substrate carrier is terminated.

Description

technical field [0001] The invention relates to a substrate conveying device and a substrate conveying method for advectively conveying a substrate to be processed. Background technique [0002] For example, in the manufacture of an FPD (flat panel display: flat panel display), a circuit pattern is formed by a so-called photolithography process. [0003] The photolithography process is specifically performed as follows. [0004] First, after forming a predetermined film on a substrate to be processed such as a glass substrate, a photoresist (hereinafter referred to as a resist) as a processing liquid is applied to form a resist film. Then, the resist is exposed and developed according to the circuit pattern. [0005] In recent years, in this photolithography process, in order to increase productivity, it is often used to apply resist coating, drying, heating, cooling, etc. to the surface to be processed while transporting the substrate to be processed in a substantially ho...

AI Technical Summary

Problems solved by technology

[0021] However, when the substrate G is stopped on the floating stage 201 for a certain period of time, the gas injected from the gas injection port 201a of the floating stage 201 continues to blow to a certain part of the lower surface of the substrate, and the temperature changes on the resist film etc. will produce transfer marks

[0022] In addition, when transferring from floating conveyance to rolling conveyance, as mentioned above, the conveyance of the substrate G is temporarily stopped, and the production capacity will be reduced.

Images