Positioning method for lead wire frame breadth direction in electroplating
A lead frame and positioning method technology, applied in the electrolysis process, electrolysis components and other directions, can solve the problems of dimensional changes, errors in estimation and processing, and the position of the positioning ring 7 cannot be adjusted, and achieves the effect of convenient adjustment.
Inactive Publication Date: 2010-05-26
深圳市长龙点金科技有限公司
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Problems solved by technology
There are currently two ways to adjust the position of the lead frame 10 in the width direction, one is to adjust the guide wheel adjustment knob 5 of the front guide wheel 1 or / and the rear guide wheel 4, and cooperate with the spring 6 on the other side of the guide wheel to make the lead frame 10 Move in the width direction to achieve the correct positioning of the lead frame 10 in the width direction, but this method must rely on the experience of skilled workers to operate, even skilled workers need 1 to 2 days, or even longer time to adjust
Another method is to add a positioning ring on the electroplating mold and press the sealing ring of the positioning ring. For this method, please refer to image 3 , it is to be provided with locating ring 7 on both sides of electroplating mold 20, is provided with the sealing ring 8 that compresses locating ring in the outside of locating ring 7, is positioned close to lead frame with locating ring, the defective of this method is: electroplating The temperature used for the mold 20, that is to say, the temperature of the electroplating solution is higher than the room temperature, the thermal expansion of the mold and the lead frame will lead to a change in size, and the size of the lead frame and the mold will also change when they are subjected to various forces.
There will be errors in the estimation and processing of dimensional changes, and the position of the positioning ring 7 cannot be adjusted, so once the positioning of the lead frame in the width direction is not accurate, it cannot be adjusted
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[0015] The present invention provides a method for positioning the lead frame in the width direction during electroplating. During electroplating, in the width direction of the lead frame 10 on the electroplating mold 20, at least one side of the lead frame 10 is provided with a set of ceramic nails 30. The other side of the lead frame 10 applies a pushing force to the ceramic nail 30 to make the lead frame 10 abut the ceramic nail 30.
[0016] See Figure 4 with Figure 5 , Figure 4 It is a schematic diagram of the principle of an implementation method of the present invention. Figure 5 Yes Figure 4 Schematic diagram of the adjusted structure. Figure 4 What is shown is that after the lead frame 10 is installed on the electroplating mold 20, the width direction of the lead frame 10 has an error. The ideal electroplating area 40 and the actual electroplating area 50 are deviated, and the lead frame 10 needs to be adjusted to the right. The ideal electroplating area 40 and the a...
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Disclosed is a location method which is to direction of lead frame width when electric plating. When electric plating, at the width direction of the lead frame (10) on electroplating die, a set of ceramic nail (30) is equipped at least one side of the lead frame, applying a thrust force to the lead frame in the direction of the ceramic nail at the other side of the lead frame to enable the lead frame to construct the ceramic nail firmly. The invention has the advantages of adjusting conveniently and not influencing by errors of designing and processing.
Description
Technical field [0001] The invention relates to a method for positioning a lead frame in the width direction during electroplating. This method is used for selective electroplating of lead frames of electronic products. These electronic products include IC, LED, diode, triode, connector and so on. Background technique [0002] The lead frame is a thin metal strip with positioning holes and areas to be plated. The electroplating of the lead frame requires selective electroplating. The so-called selective electroplating is to expose the part of the lead frame that needs to be electroplated with an electroplating mold, and shield the other parts that do not need electroplating to achieve the purpose of selective electroplating. In other words, when the lead frame passes through the electroplating mold, the area to be plated on the lead frame must be accurately aligned with the corresponding holes of the electroplating mold, so that the electroplated lead frame meets the requiremen...
Claims
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IPC IPC(8): C25D5/02C25D17/00
Inventor 曲悦峰
Owner 深圳市长龙点金科技有限公司