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Heat radiating device and electronic device with heat radiating device

A technology for heat dissipation devices and electronic devices, which can be applied to circuits, electrical components, electric solid devices, etc., and can solve problems such as large energy loss and weakening of airflow intensity.

Inactive Publication Date: 2008-06-25
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] like Figure 1B As shown, in the heat sink 1 of the prior art, after the fixing device 4 is connected to the radiator 3, one side of the fixing device 4 partially shields the gap between the cooling fins 3f of the radiator 3, and the airflow generated by the fan 2 Therefore, it is blocked and the airflow intensity is weakened; in addition, the airflow must be turned (as shown by the arrow in the figure) before it can be discharged, resulting in considerable energy loss

Method used

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  • Heat radiating device and electronic device with heat radiating device
  • Heat radiating device and electronic device with heat radiating device
  • Heat radiating device and electronic device with heat radiating device

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Embodiment Construction

[0014] Such as Figure 2A As shown, in this embodiment, the electronic device of the present invention includes a heat sink 10, a circuit board 20, and a central processing unit 30, wherein the heat sink 10 is mainly for cooling the central processing unit 30, and includes a fan F , a radiator 11 and a fixing device 12 .

[0015] It should be noted that in this embodiment, the central processing unit 30 is the main heat-generating component in this embodiment, therefore, the cooling device 10 dissipates heat to the central processing unit 30, but it is not limited thereto, and the cooling device 10 can be applied to any heating components.

[0016] The heat sink 11 includes a body 111 and a plurality of cooling fins 112 , and the cooling fins 112 are vertically disposed on the body 111 . The fixing device 12 includes a bearing seat 121 and a wire buckle 122 .

[0017] The fan F is arranged on one side of the radiator 11 and connected to the heat sink 112. The main body 111 ...

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PUM

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Abstract

The invention relates to an electronic device which is providedwith a heat dissipation device, which comprises a radiator and a fixing device. The radiator includes a body and a plurality of radiatingpieces , wherein, the body is vertical to the radiating pieces , the fixing device is connected with the radiator and is provided with a side, and the side is vertical to the radiating pieces and is lower than the body or be parallel tothe body.

Description

technical field [0001] The invention relates to an electronic device with a heat dissipation device, which improves the performance of the heat sink by using a fixing device for improving the heat dissipation device. Background technique [0002] At present, electronic products tend to be miniaturized day by day, so that the heat dissipation device in the electronic device plays a very important role. Such as Figure 1A As shown, the prior art is used to dissipate heat for a central processing unit (CPU) 1 comprising a fan 2, a radiator 3 and a fixing device 4; the fan 2 is connected with the radiator 3, and the fixing device 4 connects the radiator 3 is fixedly attached to the central processing unit, so that when the electronic device 1 is working, the heat generated by the central processing unit can be quickly transferred to the heat sink 3, and the fan 2 rotates to generate airflow to blow to the heat sink 3f of the heat sink 3, so that the The heat accumulated in the ...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/367
Inventor 辛益年关文俭
Owner GIGA BYTE TECH CO LTD