Manufacture method of electric connector

Abstract

A Method for making electric connectors comprises the following procedures: 1) providing a circuit board with a plurality of contacting pads; 2) providing a plurality of terminals; 3) welding an end of the terminal to the contacting pad of the circuit board; 4) equipping a limit outward electronic component (a limit switch component) in the periphery of terminals on the circuit board in order to keep the normal conduction of the outward electronic component and the terminal. The making method of the electronic connector forms the electronic connector via equipping a limit switch component of the limit outward electronic component in the periphery of terminals after welding with a circuit board and terminals directly, which can achieve the close arrangement of terminals, has easy making, reduces cost, and improves the competitive power of enterprises.

Description

【Technical field】 [0001] The invention relates to a manufacturing method for connecting a chip module to an electrical connector on a circuit board. 【Background technique】 [0002] At present, the electrical connector used in the industry to connect the chip module to the circuit board generally includes an insulating body and terminals disposed in the insulating body, and the terminals can transmit information of the chip module to the circuit board. However, due to the continuous development of electronic products in the direction of lightness, lightness, thinness, etc., in order to adapt to the development direction of electronic products, electrical connectors are also increasingly developed in a direction of density, such as the socket connector disclosed in US Patent No. 6,561,819, the socket In order to adapt to the densification of the chip module, the spacing between the terminals on the connector is very small and the arrangement is very dense, but there are still ...

AI Technical Summary

Problems solved by technology

However, due to the continuous development of electronic products in the direction of lightness, lightness, thinness, etc., in order to adapt to the development direction of electronic products, electrical connectors are also increasingly developed in a direction of density, such as the socket connector disclosed in US Patent No. 6,561,819, the socket In order to adapt to the densification of the chip module, the spacing between the terminals on the connector is very small and the arrangement is very dense, but there are still the following defects in actual manufacturing: 1. The electrical connector has a small spacing between the terminals so that the terminals of the insulating body are accommodated. The distance between the holes is also very small, so a very precise mold is required to manufacture the corresponding insulating body, and the cost is high; 2. The terminal has a large inclination angle and is linear, and it is difficult to install the terminal firmly in the insulating body Larger size makes assembly difficult

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