Display substrate and manufacture method thereof and display device

Abstract

The invention relates to a display substrate and a manufacture method thereof and a display device, wherein the manufacture method of the display substrate comprises: mounting LEDs of same colors to printed substrates corresponding to their color types, wherein the surface of each printed substrate is provided with mounting grooves arranged dependent on an arrangement manner of sub-pixels of corresponding color types; transfer-printing the LEDs on each printed substrate to a same substrate base board, thereby forming on each substrate base board an LED array arranged in a same manner as the sub-pixels. Based on this, the manufacture process of a colored LED display device can be simplified. Compared with the prior art, the invention enables a reduction in the complexity of the manufacture process of the colored Led display and a reduction in the cost.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] Micro-LED technology refers to the technology of integrating high-density LED (Light Emitting Diode, light-emitting diode) arrays in a tiny size. When applied to the display field, it can reduce the pixel distance from millimeters to microns. Compared with other micro-display technologies, due to the self-illumination of this type of display device, the optical system is simple, which can reduce the volume, weight and cost of the overall system, while taking into account the characteristics of low power consumption and fast response. In the existing Micro-LED display field, common substrate manufacturing methods are mainly divided into three types: 1. Manufacturing chips integrated with LED arrays on TFT (ThinFilm Transistor, thin film transistor) substrates; 2. Directly grow...

AI Technical Summary

Problems solved by technology

[0003] However, no matter which of the above-mentioned production methods, there are many technical problems in terms of realizing color display and large-size display.

For example, not all areas of the LED produced on the entire surface can be energized to emit light, and for color displays, there will be gaps between different colors, which will cause a lot of waste of materials

Another example is that there are still technical difficulties in growing large-size LEDs, and growing or splicing in different regions will increase the complexity of the process.

[0004] In this regard, although the existing technology has given the idea of ​​assembling the LED particles formed by cutting on the TFT substrate to form a single-color LED screen, it is still unable to differentiate the LED particles of different colors, and cannot accurately integrate the LED particles. The particles are fixed to the position of the corresponding color, so the assembly accuracy of the LED particles cannot be guaranteed under the color display, and there are problems of high production cost and complicated process

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