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Display substrate, manufacturing method thereof, and display device

A technology for a display substrate and a manufacturing method, which is applied in the fields of identification devices, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of complex process, increased sub-regional growth, and high production cost, and achieves simplification of the manufacturing process, reduction of material waste, The effect of optimal device characteristics

Active Publication Date: 2019-03-15
BOE TECH GRP CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

[0003] However, no matter which of the above-mentioned production methods, there are many technical problems in terms of realizing color display and large-size display.
For example, not all areas of the LED produced on the entire surface can be energized to emit light, and for color displays, there will be gaps between different colors, which will cause a lot of waste of materials
Another example is that there are still technical difficulties in growing large-size LEDs, and growing or splicing in different regions will increase the complexity of the process.
[0004] In this regard, although the existing technology has given the idea of ​​assembling the LED particles formed by cutting on the TFT substrate to form a single-color LED screen, it is still unable to differentiate the LED particles of different colors, and cannot accurately integrate the LED particles. The particles are fixed to the position of the corresponding color, so the assembly accuracy of the LED particles cannot be guaranteed under the color display, and there are problems of high production cost and complicated process

Method used

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  • Display substrate, manufacturing method thereof, and display device
  • Display substrate, manufacturing method thereof, and display device
  • Display substrate, manufacturing method thereof, and display device

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Embodiment Construction

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0036] figure 1 It is a schematic flowchart of steps of a method for manufacturing a display substrate in an embodiment of the present invention. see figure 1 , the manufacturing method of the above-mentioned display substrate includes:

[0037] Step 101: Assemble the LED particles of each color category on the printed substrate corresponding t...

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Abstract

The present invention relates to a display substrate, a manufacturing method thereof, and a display device. The manufacturing method of the display substrate includes: assembling LED particles of each color category onto a printed substrate corresponding to the respective color category; There are assembly grooves arranged on the surface according to the arrangement of the sub-pixels of the corresponding color categories; the LED particles on each of the printing templates are separately transferred to the same substrate substrate, so that the LED particles on the substrate are An array of LED particles consistent with the arrangement of sub-pixels is formed on the base substrate. Based on this, the present invention can simplify the manufacturing process of color LED display devices. Compared with the existing technology, the present invention can reduce the process complexity and cost of producing color LED display devices.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] Micro-LED technology refers to the technology of integrating high-density LED (Light Emitting Diode, light-emitting diode) arrays in a tiny size. When applied to the display field, it can reduce the pixel distance from millimeters to microns. Compared with other micro-display technologies, due to the self-illumination of this type of display device, the optical system is simple, which can reduce the volume, weight and cost of the overall system, while taking into account the characteristics of low power consumption and fast response. In the existing Micro-LED display field, common substrate manufacturing methods are mainly divided into three types: 1. Fabricate chips integrated with LED arrays on TFT (Thin Film Transistor, thin film transistor) substrates; 2. Directly on TFT ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/33
CPCG09F9/33H01L25/0753H01L33/62H01L2933/0066H01L21/6835H01L25/167H01L27/1218H01L2221/68368
Inventor 秦广奎
Owner BOE TECH GRP CO LTD