Conductive layer structure for chip encapsulation module and its making method

Abstract

The invention provides a conductive layer structure on a chip packaging module and a method for manufacturing the chip packaging module. The method mainly comprising the following steps of: drilling at least one through hole to the top of a wafer at the bottom of an insulation layer of the chip packaging module, arranging insulation materials on the inner wall of each through hole to allow a conductive layer arranged at the periphery of the insulation layer to extend to the above of the wafer and then arranging a solder mask and a circuit pin so as to constitute a conductive layer structure which can be covered entirely to prevent oxidation, can enhance EMI protection performance and suppress noise effectively. The conductive layer structure not only can solve the problem that the conductive layer of the prior chip packaging module is easy to corrode due to oxidation, but also can make the conductive layer obtain better EMI shielding at the position close to other electronic elements and further enhance the EMI protection performance of the whole chip packaging module and effectively suppress the noise of the chip packaging module; meanwhile, the conductive layer structure can avoid 'T CONTACT' type contact to be more stable.

Description

Conductive layer structure of chip packaging module and manufacturing method thereof technical field The invention relates to a chip packaging module, especially improving the conductive layer structure of the chip packaging module, aiming to provide a conductive layer structure that is completely covered to prevent oxidation, improve EMI protection performance and effectively suppress noise. Background technique In recent years, due to the requirements of light weight and miniaturization of electronic products, the assembly and construction technology of electronic components has gradually developed towards the goal of lightness, thinness, shortness and smallness. The capability of / O signal and current, and the function of providing heat dissipation and protecting the photosensitive chip must be packaged to form an integrated chip package module. The image sensor shown in Figure 1 is taken as an example, which can be regarded as one of the typical modular chip packaging...

AI Technical Summary

Problems solved by technology

In view of this, the main purpose of the present invention is to provide a conductive layer structure and related manufacturing method that can solve the problem of easy oxidation of the conductive layer of the chip package module, improve EMI protection performance, and effectively suppress noise

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