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Component package with heat converter

A technology of heat exchangers and component packages, applied in the field of component packages, can solve the problems that automatic production lines cannot be used, cannot be installed, and increase thickness

Inactive Publication Date: 2012-03-28
NAKAMURA SEISAKUSHO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the component pack 200 increases in thickness and cannot be mounted on a small-sized computer or the like
[0009] In addition, on the small component package 200, the heat radiation fins 201a are formed to a limited height, so that a sufficient heat radiation surface area cannot be obtained.
The semiconductor integrated circuit 205 therefore cannot be sufficiently cooled
[0010] Also, since the heat radiation fins 201a are formed on the package 200, when the semiconductor integrated circuit 205 is housed in the recess 202 or when the wiring substrate 203 is fixed, the stability of the package 200 is difficult to maintain.
Commonly used automated production lines cannot therefore be used, and specialized production lines must be provided
Therefore, there must be a large investment in equipment

Method used

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  • Component package with heat converter
  • Component package with heat converter
  • Component package with heat converter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment A

[0061] figure 1 is a sectional view showing an electrical package with a liquid cooling heat exchanger according to embodiment A. figure 2 is a top view showing the liquid cooling heat exchanger of Embodiment A. image 3 It is a partial cutaway perspective view showing embodiment A.

[0062] The main body plate 1A (first plate-shaped member) of the electrical package 1 with a liquid cooling heat exchanger (hereinafter simply referred to as "package 1") is formed of a metal plate. The metal plate has rigidity, good thermal conductivity, and a thermal expansion coefficient compatible with the wiring substrate (and the like described below), and can withstand deformation processing. Stainless steel, aluminum or copper alloys can be used as the metal plate.

[0063] The main body plate 1A of the package has a square recess 2 (component mounting recess) formed on the surface 1a. The entire main body plate 1A of the package has the shape of a cavity in which the bottom of the r...

Embodiment B

[0121] Figure 17 A cross-sectional view showing an electrical component package (hereinafter simply referred to as "package") having a cooling portion according to Embodiment B of the present invention. Figure 18 To show the top view of the cooling part of embodiment B. Figure 19 to be perpendicular to Figure 17 Sectional view of the package section cut in mid-section. Figure 20 It is a partial cutaway perspective view showing embodiment B.

[0122] The main body plate 101 (first plate-shaped member) of the component pack 100 according to the present embodiment is formed of a metal plate. The metal plate has rigidity, good thermal conductivity, a coefficient of thermal expansion compatible with that of a wiring substrate, etc. described below, and can withstand deformation processing. Stainless steel, aluminum, or copper alloys may be used as the metal plate.

[0123] The package main body plate 101 has a square recess 102 (component mounting recess) formed on the su...

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Abstract

In an electrical component package (1) which is provided with a heat exchanger (20) with liquid cooling, a main body plate (1A) and a crown-shaped part (5) of the component package consisting of metal plates are jointly connected. A hollow part (6) is formed in the middle and is taken as the heat exchanger for liquid cooling, wherein, a working liquid is sealed inside. A dent (2) used for installing the electrical component (8) to be cooled is formed on the outer surface of the main body plate (1A) in the component package which is arranged corresponding to the hollow part (6). The internal surface (5a) of the hollow part (6) facing the main body plate (1A) of the component package is engraved by engraving tools; therefore, radiation fins (3) are formed on the internal surface in a small pitch. A small groove (4) used for moving the working liquid is formed among the fins; therefore, the flat electrical component package can have the heat exchanger with liquid cooling which has excellent thermal radiation function.

Description

technical field [0001] The invention relates to a package integral with a heat exchanger. In particular, the invention relates to a package with a heat exchanger, suitable as an electrical package, wherein the liquid cooling heat exchanger is integrated into the cavity-shaped package and forms a cavity in the metal plate for the storage of electrical components, That is, stiffeners or heat sinks. Background technique [0002] The rate at which computer devices have decreased in size and increased in performance has accelerated at an even greater pace over the past few years. However, heat generated from semiconductor elements and integrated circuits is also increasing with performance, and methods of effectively cooling this heat are being sought to further advance in miniaturization and performance. To cool highly integrated, high output chips and the like, heat radiators are typically attached to the package and cooling fans are used as forced air cooling if necessary. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/367
CPCH01L2924/0002B21J5/068H01L2924/00
Inventor 宫原英行
Owner NAKAMURA SEISAKUSHO KK