Plasma generator and workpiece processing apparatus using the same

A plasma and generating device technology, which is applied in the fields of plasma, chemical/physical/physicochemical process of applied energy, semiconductor/solid-state device manufacturing, etc., can solve the problems of high price, unstable discharge, high voltage, etc., and achieve low Cost, easily controllable effect

Inactive Publication Date: 2008-12-03
SAIAN CORP
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  • Abstract
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  • Application Information

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Problems solved by technology

[0005] In the prior art of the above-mentioned Patent Document 2, although the processing gas for plasmaization is relatively uniform and can be irradiated in a linear manner, since glow discharge is performed in parallel plate electrodes, a high voltage is required, and there is a cost. Expensive and issues with erratic discharge
In addition, local arc discharge is also easy to occur, and in order to suppress arc discharge, a dielectric must be coated on at least one electrode, which requires a higher voltage

Method used

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  • Plasma generator and workpiece processing apparatus using the same
  • Plasma generator and workpiece processing apparatus using the same
  • Plasma generator and workpiece processing apparatus using the same

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Embodiment Construction

[0024] FIG. 1 is a perspective view showing the overall configuration of a workpiece processing apparatus S according to one embodiment of the present invention. This workpiece processing apparatus S includes: a plasma generating unit PU (plasma generating unit) that generates plasma and irradiates the plasma to a workpiece W that is an object to be irradiated; and a conveying device C that passes through the plasma The workpiece W is conveyed along a predetermined path in the irradiation area. FIG. 2 is an exploded perspective view of the plasma generation unit PU viewed from a viewing direction different from that of FIG. 1 , and FIG. 3 is a partial perspective side view. In addition, in Figures 1 to 3, the X-X direction is set as the front-rear direction, the Y-Y direction is the left-right direction, the Z-Z direction is the up-down direction, and the -X direction is the front, the +X direction is the rear, and the -Y direction is the left , the +Y direction is rightward,...

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Abstract

Disclosed are a plasma generator and a workpiece processing apparatus, wherein an adapter 38 is attached to a distal end of each of a plurality of plasma generation nozzles 31 to convert a spot-shaped spout port of the plasma generation nozzle 31 to a lengthwise sport port 387, and a cover member 93 is provided to cover the plasma generation nozzles 31 so as to allow a narrow space to be defined between the cover member 93 and a workpiece, whereby plasma spouted from the spout port 387 is retained in the space in such a manner as to hit against and rebound from the workpiece into the space.; This makes it possible to subject a workpiece having a relatively large surface area to plasma exposure in a uniform manner, while suppressing cooling of plasma in the space to allow the plasma to survive for a relatively long period of time (reduce a plasma disappearance rate) so as to provide enhanced efficiency of plasma exposure.

Description

technical field [0001] The present invention relates to a plasma generator capable of cleaning or reforming the surface of an object to be irradiated (work) such as a substrate by irradiating plasma to the object to be irradiated, and a workpiece processing apparatus using the same. Background technique [0002] A workpiece processing apparatus is known that removes organic pollutants on the surface, modifies the surface, etches, forms a thin film, or removes a thin film by irradiating plasma to an object to be irradiated (work) such as a semiconductor substrate. For example, Japanese Patent Laid-Open Publication No. 2003-197397 (Patent Document 1) discloses a plasma processing apparatus that uses a plasma generating nozzle having concentric inner electrodes and outer electrodes. Applying a high-frequency pulsed electric field does not generate arc discharge, but generates glow discharge to generate plasma, so that the processing gas from the gas supply source swirls between...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/3065H05H1/26C23C16/455C23F4/00H01J37/32
CPCH01J37/32825H05H1/46H01L21/67069H01J37/32192H05H1/26B01J19/08
Inventor 三毛正明万川宏史增田滋林博史
Owner SAIAN CORP
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