Plasma generator and workpiece processing apparatus using the same

Abstract

Disclosed are a plasma generator and a workpiece processing apparatus, wherein an adapter 38 is attached to a distal end of each of a plurality of plasma generation nozzles 31 to convert a spot-shaped spout port of the plasma generation nozzle 31 to a lengthwise sport port 387, and a cover member 93 is provided to cover the plasma generation nozzles 31 so as to allow a narrow space to be defined between the cover member 93 and a workpiece, whereby plasma spouted from the spout port 387 is retained in the space in such a manner as to hit against and rebound from the workpiece into the space.; This makes it possible to subject a workpiece having a relatively large surface area to plasma exposure in a uniform manner, while suppressing cooling of plasma in the space to allow the plasma to survive for a relatively long period of time (reduce a plasma disappearance rate) so as to provide enhanced efficiency of plasma exposure.

Description

technical field [0001] The present invention relates to a plasma generator capable of cleaning or reforming the surface of an object to be irradiated (work) such as a substrate by irradiating plasma to the object to be irradiated, and a workpiece processing apparatus using the same. Background technique [0002] A workpiece processing apparatus is known that removes organic pollutants on the surface, modifies the surface, etches, forms a thin film, or removes a thin film by irradiating plasma to an object to be irradiated (work) such as a semiconductor substrate. For example, Japanese Patent Laid-Open Publication No. 2003-197397 (Patent Document 1) discloses a plasma processing apparatus that uses a plasma generating nozzle having concentric inner electrodes and outer electrodes. Applying a high-frequency pulsed electric field does not generate arc discharge, but generates glow discharge to generate plasma, so that the processing gas from the gas supply source swirls between...

AI Technical Summary

Problems solved by technology

[0005] In the prior art of the above-mentioned Patent Document 2, although the processing gas for plasmaization is relatively uniform and can be irradiated in a linear manner, since glow discharge is performed in parallel plate electrodes, a high voltage is required, and there is a cost. Expensive and issues with erratic discharge

In addition, local arc discharge is also easy to occur, and in order to suppress arc discharge, a dielectric must be coated on at least one electrode, which requires a higher voltage

Images