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Device for manufacturing fluid layers with pre-determined thickness on a framework

A technology of predetermined thickness and fluid layer, which is applied in the field of fluid layer devices, can solve problems such as unhandy and poor handling, and achieve the effects of good adaptation, simple mechanical properties, and good design feasibility

Active Publication Date: 2013-03-13
SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Components with, for example, contacts that are too small or too large are processed only poorly or not at all by this device

Method used

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  • Device for manufacturing fluid layers with pre-determined thickness on a framework
  • Device for manufacturing fluid layers with pre-determined thickness on a framework

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0046] A device 100 for producing a solder layer is shown in FIG. 1 . The device 100 includes a carrier plate 140 on the surface of which a layer of solder 144 is applied. A flux reservoir 124 is provided for applying the fluid layer 144 , which is stored in the reservoir chamber 122 of the flux container 120 . The storage cavity 122 of the flux container 120 is open downwards, so that when the flux container 120 is moved over the surface of the carrier plate 140 in the direction shown by the arrow 123, the flux 124 flows out from the lower hole of the storage cavity 122 and thus And coated on the surface of the carrier plate 140 .

[0047] Fluid layer 144 has a layer thickness d1 , which is also shown in FIG. 1 and results from the distance d2 between the surface of carrier plate 140 and the lower edge of fluid container 120 , which is shown in detail A of FIG. 1 . In order to apply the layer, the fluid container 120 is moved completely in the direction of the arrow 123 fro...

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PUM

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Abstract

The device (100) has liquid carrier plate (140) and a liquid container that is moved or shifted over the liquid carrier plate for applying a liquid layer on a surface of the liquid carrier plate. A lifting device is provided with which the surface of the liquid carrier plate is slidably relative to the liquid container, particularly to a lower edge of the liquid container. Independent claims are also included for the following: (1) a mounting machine for mounting electrical and optical component of substrate (2) a method for manufacturing liquid layers with a device (3) a method for mounting electrical and optical component using mounting machine.

Description

technical field [0001] The present invention relates to a device for producing a fluid layer with a predetermined thickness on a carrier, the device comprising a fluid carrier plate and a fluid container for applying the fluid layer to the surface of the fluid carrier plate and in the fluid The carrier plate can be moved or moved. Background technique [0002] Such devices are known in the prior art. US 6,293,317 B1 discloses a device for producing a fluid layer in holes in a carrier plate, in which device a fluid container is moved on a carrier plate with holes and a fluid layer is produced in the holes. A disadvantage of the so-called prior art is that the thickness of the fluid layer is determined by the depth of the holes inside the carrier plate. In specific applications of the fluid, it is of course required that the thickness of the fluid layer be flexibly adaptable. Thus, for example, when the electrical contacts of components are wetted with flux or solder paste,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C1/00B05C13/02
CPCH01L21/67023H01L21/67017H01L21/6715
Inventor 克里斯蒂安·达施纳弗里德里克·埃申韦克米夏埃尔·尼德迈尔托马斯·蔡格
Owner SIEMENS ELECTRONICS ASSEMBLY SYST LLC