Method for regulating resistivity of polycrystal Fe3O4 thin-film material
A thin-film material and resistivity technology, which is applied in the field of adjusting the resistivity of polycrystalline Fe3O4 thin-film materials, can solve the problems such as the resistivity mismatch between magnetic thin-film materials and semiconductor materials, and achieve the effects of easy control, mild conditions and simple process.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0026] The DPS-III ultra-high vacuum magnetron sputtering coating machine of the Shenyang Keyi Center of the Chinese Academy of Sciences is used. The iron target with a purity of 99.99% is installed on the target platform, and the vacuum degree of the back and bottom of the sputtering vacuum chamber is optimized before sputtering. In (i.e. less than) 1.0×10 -5 Pa, keep the distance between the substrate and the iron target at 8cm during sputtering, the flow rate of argon gas is 10sccm, the flow rate of oxygen gas is 4.0sccm, the DC power of 150W is set on the iron target, and the substrate is not heated. After the sputtering deposition is completed, turn off the DC power supply of the iron target, continue to maintain the same flow rate of argon and oxygen for half an hour, open the vacuum chamber, and take out the prepared thin film sample. After measurement, the prepared polycrystalline Fe 3 o 4 The resistivity of the film at room temperature (300K) is 3.6×10 5 μΩcm.
Embodiment 2
[0028] Using the DPS-III type ultra-high vacuum magnetron sputtering coating machine of Shenyang Science Instrument Center, Chinese Academy of Sciences, the polycrystalline Fe prepared in Example 1 3 o 4 The film is placed in a vacuum chamber, evacuated to a high vacuum state, a certain pressure of air is introduced into the vacuum chamber, and annealed at the required annealing temperature for a certain period of time. Keep the pressure in the vacuum chamber at a constant value during the annealing process. Cool naturally after annealing, open the vacuum chamber, take out the prepared film sample, and measure the resistivity of the sample at room temperature (300K). The resistivity of the annealed sample under different conditions measured is listed in Table 1;
[0029] Table 1 Fe 3 o 4 Resistivity change of thin film samples when annealed in air:
[0030]
[0031]
Embodiment 3
[0033] Using the DPS-III type ultra-high vacuum magnetron sputtering coating machine of Shenyang Science Instrument Center, Chinese Academy of Sciences, the polycrystalline Fe prepared in Example 1 3 o 4 The film is placed in the vacuum chamber, evacuated to a high vacuum state, and a certain pressure of O is introduced into the vacuum chamber. 2 Gas, annealing at the desired annealing temperature for a certain period of time. Keep the pressure in the vacuum chamber at a constant value during the annealing process. Cool naturally after annealing, open the vacuum chamber, take out the prepared film sample, and measure the resistivity of the sample at room temperature (300K). The resistivity of the annealed sample under different conditions measured is listed in Table 2;
[0034] Table 2Fe 3 o 4 film samples in O 2 Resistivity change during annealing in air:
[0035]
PUM
| Property | Measurement | Unit |
|---|---|---|
| Curie point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More