Heat-resisting structure

Abstract

The invention discloses a heat resistance structure which is applied to a printing circuit board provided with a through hole. The heat resistance structure is arranged around the welding pad of the through hole and is provided with at least one heat resistance block which is arranged in a single radial direction of the through hole so as to lead the periphery of the through hole to have large wiring space, thus solving the problems of the prior art.

Description

technical field [0001] The invention relates to a heat-resisting structure, more specifically, to a heat-resisting structure applied to a printed circuit board with through holes. Background technique [0002] With the development of portable electronic products in the direction of "light, thin, short and small", in order to cope with the characteristics of information communication, IA industry portability, lightness and shortness, printed circuit boards will move towards high-density wiring (layout) , composite multi-layer, small structure, powerful function, and thin plate. At the same time, since the wiring and signal integrity of the printed circuit board will directly affect the performance and reliability of the actual product, how to fully consider the signal integrity factor in the design process of the printed circuit board and take effective control measures , has become a hot topic in today's printed circuit board design industry. [0003] At present, when the ...

AI Technical Summary

Problems solved by technology

[0006] However, although the heat-resistant structure 3 can avoid the above-mentioned defects caused by the absence of a heat-resistant structure around the solder pad of the through hole, the heat-resistant block 32 is a fixed structure surrounding the solder pad 31; In this way, when laying signal lines (not shown), the distance between the periphery of the pad 31 and the heat-resistant block 32 is too small, and the signal line must pass through the heat-resistant block 32, so that due to wiring The space is too narrow and the line cross-layer phenomenon occurs

At the same time, the occurrence of the cross-layer phenomenon will inevitably destroy the integrity of the signal line and affect the signal characteristics of the signal line 40, especially for high-speed signal lines, causing the signal line to fail to meet the design requirements, and thus result in a decrease in the product quality of the printed circuit board

[0007] Furthermore, as shown in FIG. 4 , the heat-resistant block 32 arranged around the periphery of the welding pad 31 needs to occupy a larger space, so a larger opening space must be reserved on the edge 51 of the printed circuit board 5, so that Wiring area limited

Moreover, if the board edge 51 of the printed circuit board 5 does not reserve a large opening space, the use of this heat-resistant structure will make the plug-in components close to the board edge 51 of the printed circuit board 5 poor contact.

Therefore, this heat-resistant structure of the prior art cannot be arranged on the board edge area of ​​the printed circuit board

Moreover, if the heat-resisting structure is arranged on the edge area of ​​the printed circuit board, it is easy to cause the heat-resisting block to be outside the effective wiring area of ​​the printed circuit board, so that the heat-resisting block loses its heat-resisting effect.

Therefore, this prior art is not conducive to the circuit layout of the edge of the printed circuit board.

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