11 results about "Printed circuit board design" patented technology

The application discloses a board card design method and electronic equipment, and relates to the field of printed circuit board design. The method comprises the following steps: obtaining a design file of a board card, wherein the design file comprises first electrical parameters and first structural parameters of a first component on the board card; processing the first electrical parameters and the first structural parameters to obtain a first identifier corresponding to the first component; obtaining current second electrical parameters, second structural parameters and a second identifier of the first component in a feature library; determining that the first component in the design file has been updated in the feature library when the first identifier is different from the second identifier; determining first difference information between the first electrical parameters and the second electrical parameters, and second difference information between the first structural parameters and the second structural parameters; and determining risk information of the first component that is not updated in the design file based on the first difference information and the second difference information. The method can solve the problem that the packaging update cannot be identified in time in the related art.

The application relates to the field of printed circuit board computer-aided design and manufacturing technology, and discloses a printed circuit board copper conductive structure acute angle detection method and device and electronic equipment, the method comprises the following steps: acquiring two-dimensional closed graphs corresponding to each copper conductive structure existing in intersection relation on a printed circuit board; merging each two-dimensional closed graph to form a merged graph defined by a contour ring; calculating the included angle at each vertex on the contour ring of the merged graph; and detecting an acute angle with an included angle less than a preset acute angle threshold. The "hidden" acute angle newly generated after the intersection and merging of multiple copper conductive graphs, which cannot be recognized by a traditional DRC method, can be automatically and accurately detected, so that the reliability and manufacturability of printed circuit board design are effectively improved.

A header-less printed circuit board connector system (HLPCBC) comprising novel terminal connectors and printed circuit board (PCB) designs that eliminate the need to solder a stamped blade or PCB header to a PCB. The HLPCBC comprises a plurality of blade terminals formed from the PCB material extending from the PCB. The blade terminals are separated by terminal gaps. A complementary multi-blade terminal connector is used to couple with the terminal connectors. In some forms the multi-blade terminals are arranged in single or multiple planes. Metal plating can extend across the layers of blade terminals to increase strength or can be used for strain relief. The PCBs can be housed in a PCB housing having a blade support wall. The HLPCBC comprises blade terminals on one end of the PCB, whereas in other embodiments, blade terminals extend from opposed ends of the PCB.

The application provides a kind of medium-high voltage printed circuit board and its insulation strengthening method, it is related to printed circuit board insulation design technical field, the method is based on the initial structure data between positive direct current terminal pad and negative direct current terminal pad, obtains first insulation strengthening data;Based on the initial structure data between direct current pad and system midpoint potential conductor, obtains second insulation strengthening data;Based on the initial structure data at the capacitor terminal pad, obtains third insulation strengthening data;Based on the initial structure data of hole array area, the method of adding the shielding layer extending radially outside under the hole array area is used to obtain fourth insulation strengthening data;Based on first insulation strengthening data, second insulation strengthening data, third insulation strengthening data and fourth insulation strengthening data, the method of adding the outermost layer of insulation material to printed circuit board is used to obtain insulation strengthening result.The application solves the problems of high cost and poor insulation performance of the existing printed circuit board design method.

This printed circuit board design device comprises: a grouping processing unit (8) that generates a plurality of circuit diagram groups by dividing a circuit diagram into a plurality of pieces; a component classification unit (10) that classifies components into parent components, child components directly or indirectly connected to the parent components, and other components; a proximity block generation unit (11) that generates a plurality of proximity blocks, each containing parent and child blocks; and an overall layout design unit (15) that arranges the parent components within the plurality of proximity blocks, and arranges the child components within the proximity blocks on the basis of the layout of the parent components.

The application discloses a differential line arc automatic wiring method and device for high-density BGA, and relates to the technical field of printed circuit board design. The method comprises the following steps: firstly, obtaining netlist, BGA pins and design rules and other wiring information, and constructing a graph model containing virtual pins based on the wiring information. Then, constraint-driven path search is performed based on the model to generate an initial polyline path, and the initial polyline path is optimized into a smooth circular arc path by using geometric rules. Subsequently, post-processing such as differential pair generation and tangent continuity check is performed to ensure signal integrity. Finally, through comprehensive wiring optimization and verification, the final wiring file is output. The application can complete the wiring task in a very short time when processing industrial high-density BGA layout, realizes thousands of times acceleration compared with manual wiring, and maintains a very high wiring rate and standard geometric shape.

The application relates to the fields of printed circuit board design and processing technology, and particularly relates to a printed circuit board and a printed circuit board assembly. The printed circuit board comprises: a substrate; and a transition edge located at at least one board edge of the substrate; the substrate is provided with a stress-sensitive area adjacent to the transition edge, at least one welding site for welding a stress-sensitive component is arranged in the stress-sensitive area, and a groove structure is arranged on the transition edge, the groove structure is located at a side of the welding site in a direction perpendicular to the extension direction of the transition edge and is adjacent to the substrate, and is used for limiting the transmission of stress generated when the transition edge is removed to the welding site. By actively weakening the local structure of the transition edge through the groove structure to limit the stress transmission, the influence of stress release when the transition edge is removed on the stress-sensitive component of the adjacent welding site is reduced, the damage risk of the stress-sensitive component is reduced, and the yield is improved.

This application relates to a routing method applied to printed circuit board (PCB) design. First, the area to be optimized for routing on the PCB is divided into several annular regions. These annular regions are then further divided into quadrants. Next, all quadrants within the annular regions that require correction are selected. A global shortest path is obtained by connecting all the quadrants in the global shortest path. Finally, the routing is performed sequentially from the inside out on the quadrants included in the global shortest path corresponding to each annular region until the routing of the area to be optimized on the PCB is complete. This routing method enables automated analysis and processing of the routing area to be optimized, thereby achieving routing area optimization. This not only significantly reduces manpower input in the PCB design process and saves manufacturing costs, but also effectively improves the circuit design quality of the PCB, thus ensuring the performance and reliability of the PCB.

The application relates to the technical field of printed circuit board design, and discloses a DRC result visualization method and device for PCB design and electronic equipment. The method comprises the following steps: when DRC result visualization rendering is performed, for at least two DRC violation items at the same coordinate position in the same physical layer, the priority value and the violation type identifier of each violation item are obtained; a superimposed rendering layer stack is constructed based on the priority value, and each violation item is allocated a rendering layer; the higher the priority, the higher the layer sequence position; for each violation item, the visual presentation parameter is obtained based on the violation type identifier, and a graphical element is formed on the corresponding rendering layer; the superimposed rendering layer stack is subjected to composite rendering, and a DRC fusion visual identifier associated with the coordinate position and fused with the graphical elements is generated. The fine and prioritized visual fusion and presentation of multiple violation information at the same coordinate position are realized, and the auditing efficiency and accuracy of high-density PCB design are improved.