The invention discloses a high-frequency and high-speed 
ceramic leadless shell for parallel 
seam welding, and relates to the technical field of 
semiconductor packaging devices. The shell comprises a 
ceramic part, a sealing ring and a 
metal cover plate, wherein a back grounding 
metal pattern is arranged on the back of the 
ceramic part, a plurality of grounding terminals protruding outwards are arranged on the back grounding 
metal pattern, radio-frequency 
signal transmission pads are arranged between the grounding terminals, a front grounding metal pattern is connected with the back grounding metal pattern via an internal or external metallic 
interconnection hole, a front grounding wire is connected with the back grounding metal pattern via an internal or external metallic 
interconnection hole, and radio-frequency 
signal transmission wires are connected with the radio-frequency 
signal transmission pads via separate external or external and internal combined metallic 
interconnection holes. The shell is low in echo loss and 
insertion loss and good in flatness in band, does not have 
resonance points, can realize a parallel 
seam welding sealing mode, reduces the difficulty and the cost of a sealing process, guarantees high reliability and high 
air tightness, and is favorable for batch application.