High-frequency and high-speed ceramic leadless shell for parallel seam welding

Abstract

The invention discloses a high-frequency and high-speed ceramic leadless shell for parallel seam welding, and relates to the technical field of semiconductor packaging devices. The shell comprises a ceramic part, a sealing ring and a metal cover plate, wherein a back grounding metal pattern is arranged on the back of the ceramic part, a plurality of grounding terminals protruding outwards are arranged on the back grounding metal pattern, radio-frequency signal transmission pads are arranged between the grounding terminals, a front grounding metal pattern is connected with the back grounding metal pattern via an internal or external metallic interconnection hole, a front grounding wire is connected with the back grounding metal pattern via an internal or external metallic interconnection hole, and radio-frequency signal transmission wires are connected with the radio-frequency signal transmission pads via separate external or external and internal combined metallic interconnection holes. The shell is low in echo loss and insertion loss and good in flatness in band, does not have resonance points, can realize a parallel seam welding sealing mode, reduces the difficulty and the cost of a sealing process, guarantees high reliability and high air tightness, and is favorable for batch application.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging devices, in particular to a high-frequency and high-speed ceramic leadless shell capable of parallel seam welding. Background technique [0002] With the development of modern wireless communication technology, microwave radio frequency systems are required to develop towards higher frequency, higher speed, and wider frequency band. Therefore, MMIC and its packaging technology, which are the core components of microwave radio frequency systems, are also facing new challenges. The ideal MMIC packaging shell not only requires a solid mechanical structure so that the circuit is protected from exposure to the external environment, but also must ensure the integrity of microwave signals and electrical signals, and the adequacy of grounding. For high-power MMICs, the packaging shell must also ensure good heat dissipation. [0003] The radio frequency performance of the traditional ceram...

AI Technical Summary

Problems solved by technology

[0003] The radio frequency performance of the traditional ceramic four-sided leadless flat shell does not completely cover the X-band, and the return loss deteriorates rapidly with frequency, and it is difficult to eliminate the resonance point in the band; in addition, the ceramic wall of the shell with this structure is narrow, so it can only be sealed with alloy solder This sealing method is complex in process and high in cost, resulting in higher cost of integrated circuits, which is not conducive to the continuous reduction of the cost of ceramic packaging of the shell

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