800G optical module

Abstract

The invention provides an 800G optical module, which is simple and reliable in structure, increases the layout space, avoids the over-compact arrangement of optical chips or circuits and greatly reduces the crosstalk between signals. The optical module comprises a main heat dissipation shell and an auxiliary heat dissipation shell which can be spliced into a whole, wherein an accommodating cavity is formed between the main heat dissipation shell and the auxiliary heat dissipation shell. An accommodating cavity is formed in the main heat dissipation shell, a PCB is arranged in the accommodating cavity, a control chip is arranged on the PCB, and the LED lamp is characterized in that the PCB comprises an electric port part and a thickening part, the electric port is formed in the electric port part, a transmitting end is arranged on one side, close to the main heat dissipation shell, of the thickening part of the PCB, and the transmitting end is connected to an optical port after being connected with an optical fiber. A receiving end is arranged on one side, close to the auxiliary heat dissipation shell, of the thickened part of the PCB, and the receiving end is connected to the optical port after being connected with an optical fiber.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an 800G optical module. Background technique [0002] With the continuous rapid development of my country's optical communication industry and the renewal and upgrading of communication technology, optical modules, as the basis for building modern high-speed information networks, play a central role in the optical communication industry, and their continuous development is an inevitable trend. The current development of optical modules is mainly manifested in high speed and high density. The transmission rate has ranged from 1.25G to 10G, 25G, 100G in the past, and now to 400G and 800G. The packaging method has changed from the original TO package to the COB package. From low-end to high-end, it is becoming more and more small-sized and high-density, and the development is rapid. [0003] As the rate requirements of optical modules are getting higher and higher, th...

AI Technical Summary

Problems solved by technology

Due to the complexity of the current 800G optical module supporting circuit, there are many types and quantities of electronic components, and it is necessary to set avoidance or installation gaps on the PCB board during design. If the optical chip is packaged with the traditional COB solution, it will inevitably cause supporting circuits and Insufficient layout space for components, low PCB strength, high signal crosstalk, and low reliability

[0005] The existing 800G optical module supporting circuit is relatively complex, the types and quantities of components are various, the wiring density is increased, and the signal integrity problem is becoming more and more prominent. The current COB packaging process can no longer meet the demand, and most of them adopt the packaging method of BOX and flexible board.

The 800G optical module has a high transmission rate, a large transmission capacity, and a large number of electronic components and electrical interfaces. If the flexible board and the PCB are electrically connected by soldering, due to the limited space of the PCB layout, the width of the soldering pad cannot be low. If it is less than 0.2mm, the soldering yield cannot be guaranteed, so the reliability of this packaging method is low

If the flexible board and the PCB are electrically connected by gold wire bonding, although the reliability is improved to a certain extent, it still cannot effectively solve the problems of signal crosstalk and layout space.

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