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Cutting blade detection mechanism

A technology of cutting inserts and detection mechanisms, applied in electrical components, fine working devices, circuits, etc., to achieve the effect of improving production efficiency

Active Publication Date: 2009-04-08
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, the operator manually rotated the adjustment screw, so there was a troublesome problem

Method used

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  • Cutting blade detection mechanism
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  • Cutting blade detection mechanism

Examples

Experimental program
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Embodiment Construction

[0021] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 An appearance of a cutting device (dicing device) 2 capable of cutting a wafer into individual chips (devices) is shown.

[0022] On the front surface side of the cutting device 2 is provided an operating member 4 for an operator to input instructions to the device such as machining conditions. A display unit 6 such as a CRT is provided on the upper part of the device, and the display unit 6 displays a guidance screen for an operator or an image captured by an imaging unit described below.

[0023] like figure 2 As shown, on the surface of the wafer W to be cut, a first street S1 and a second street S2 are formed orthogonally, and a large number of devices D are formed on the surface divided by the first street S1 and the second street S2. on wafer W.

[0024] The wafer W is attached to the dicing tape T which is an adhesive tape, and the outer peri...

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PUM

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Abstract

The present invention relates to a cutting blade detection mechanism, which can always locate the light-emitting end-face of a light-emitting section and the light receiving end-face of a light receiving section at appropriate positions relative to the cutting blade. The cutting blade detection mechanism is used on a cutting apparatus including: a chuck worktable, holding objects to be processed; and a cutting element, on which are rotatably mounted with cutting blades. The cutting blade detection mechanism is characterized in that it includes: a light-emitting section; a light receiving section receiving the light emitted from the light-emitting section; a supporting member, supporting the light-emitting end-face of the light-emitting section and the light receiving end-face of the light receiving section into a cutting edge clipping the cutting blade; and a locating element, moving the supporting member towards the rotating axial center direction of the cutting blade according to the abrasion of the cutting edge of the cutting blade, so that the light-emitting end-face of the light-emitting section and the light receiving end-face of the light receiving section are at appropriate positions relative to the cutting blade.

Description

technical field [0001] The invention relates to a cutting blade detection mechanism in a cutting device. Background technique [0002] A semiconductor wafer that has a large number of devices such as IC (Integrated Circuit) and LSI (large scale integration) formed on the surface, and is divided into individual devices by dividing lines (spacing lanes). After the back surface is ground to a predetermined thickness with a grinding device, the planned dividing line is cut by a cutting device (cutting device) to be divided into individual devices, and used in electrical equipment such as mobile phones and personal computers. [0003] The cutting device includes at least a chuck table holding a semiconductor wafer and a cutting member for cutting the wafer held on the chuck table, and the cutting device can divide the semiconductor wafer into individual devices with high precision. [0004] On the cutting member, a cutting blade detecting mechanism is arranged, and the emitting ...

Claims

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Application Information

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IPC IPC(8): B28D5/02H01L21/00H01L21/78
Inventor 关家一马石井茂
Owner DISCO CORP