Method for manufacturing hollowed-out board

Abstract

The present invention discloses a method for manufacturing a hollow board, which comprises the following steps: pressing a first covering film formed with a punching opening and a punching positioning hole on the first surface of a copper foil; then after a second surface of the copper foil is subjected to line molding, pressing a second covering film on the second surface of the copper foil so as to obtain a circuit board; subsequently, perforating in alignment with the punching positioning hole on the first covering film so as to form a punching positioning through hole on the circuit board; and then punching the circuit board taking the punching positioning through hole as a reference so as to punch out a hollow pattern within the area of the punching opening. The method for manufacturing the hollow board has the advantages that the distance between the punching opening and the punching positioning through hole is kept unchanged, so the distance between the punching opening and the hollow pattern is ensured to be unchanged, the punching precision is improved, and the phenomenon of poor deflective punching is avoided effectively.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, relates to a method for manufacturing a hollow board. Background technique [0002] Usually, the hollow board is one of the printed circuit boards, which is formed by laminating cover films on both sides of the copper foil, and punching out partial hollow patterns on the circuit board through a stamping process. Such as figure 1 As shown, the existing hollow board manufacturing process is generally as follows: firstly, the first press-fit alignment hole 2 is drilled on the copper foil 1; A cover film 4 is press-fitted on the first surface of the copper foil 1, and it is ensured that the second press-fit alignment hole 2' on the first cover film 4 is aligned with the first press-fit pair drilled on the copper foil 1. The position holes 2 are aligned; then the line film 6 formed with the third pressing alignment hole 2 "and the punching positioning hole 5"...

AI Technical Summary

Problems solved by technology

[0003] However, the defect of this existing manufacturing method is that due to the influence of factors such as the lamination accuracy of the cover film, the lamination accuracy of the line film, and the lamination shrinkage difference of the cover film, the gap between the punched opening 3 ′ and the hollow figure 9 The distance between them is uncertain, so there is often a phenomenon of poor punching when stamping

Images