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Radiating device

A technology of heat sink and radiator, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., and can solve the problems of lack of versatility and poor utilization of functional components

Inactive Publication Date: 2009-07-01
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the installation process of the heat sink, first a pair of fixing pieces 70 need to be installed on the top of the radiator 80. The fan 90 is fixed on the top of the fan fixing piece 70 by screws; after the fan 90 is installed on the top of the radiator 80, a pair of mounting brackets 60 need to be fixed on the opposite sides of the bottom of the radiator 80 by screws, for several The buckle is worn, in order to install the fan 90 and fix the entire cooling device, corresponding functional components need to be installed respectively, obviously the utilization rate of each functional component is not good, and there is no multi-functionality

Method used

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Embodiment Construction

[0016] see Figure 1 to Figure 3 , the heat dissipation device of the present invention is used to dissipate heat from a heat-generating electronic component 52 mounted on a circuit board 50, and includes a heat sink 10, four mounting brackets 20, and four fixing pieces 30 respectively inserted in the mounting brackets 20 And a fan 40 fixed on the top surface of the radiator 10 through the mounting bracket 20 , wherein the mounting bracket 20 can not only fix the fan 30 on the radiator 10 but also fix the heat sink on the circuit board 50 .

[0017] The circuit board 50 has four mounting holes 54 uniformly and symmetrically formed around the electronic component 52 for the fixing member 30 to pass through.

[0018] The heat sink 10 includes a polygonal prism main body 12 and a bifurcation plate 120 extending outward from an edge of the main body 12 . In this embodiment, the main body 12 is a quadrangular prism. Several cooling fins 14 extend from the side of the main body 12...

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Abstract

A heat sink includes a radiator, a fan and a plurality of mounting frames. The radiator includes a main body part and a plurality of radiating fins extending from the main body part. The main body part extends outwards and arranges a plurality of branch plates; buckling parts are arranged at the tail ends of the branch plates; the mounting frames include a fixing plate in fit and fixation with the buckling parts, a supporting plate extending from the top end of the fixing plate and supporting and fixing the fan, and a mounting part extending from the bottom end of the fixing plate. The mounting frames of the heat sink provide a structure for fixing the fan at the top part of the radiator and fixing the whole heat sink on a circuit board, and the heat sink has the advantage of multifunction integration.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a mounting bracket. Background technique [0002] With the rapid development of the electronic industry, the computing speed of the electronic components in the computer has been greatly increased, and the heat generated by it has also increased sharply. How to dissipate the heat of the electronic components to ensure their normal operation has always been a must for the industry. The problem. As we all know, the central processing unit installed on the motherboard is the core of the computer system. When the computer is running, the central processing unit generates heat. Excessive heat can prevent the CPU from functioning properly. In order to effectively dissipate the heat generated by the CPU during operation. [0003] Usually installed on the central processing unit as Figure 7 The heat sink shown in order to dissipate the heat it generates. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/40G06F1/20
Inventor 徐宏博
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD