Method of manufacturing a semiconductor sensor device and semiconductor sensor device obtained with such method

Abstract

The invention relates to a method of manufacturing a semiconductor sensor device (10) for sensing a substance (30) and comprising a strip-shaped semiconductor region (1) which is formed on a surface of a semiconductor body.(11) and which is connected at a first end to a first electrically conducting connection region (3) and at a second end to a second electrically conducting connection region (4) while a fluid (20) comprising a substance (30) to be sensed can flow along a side face of the strip-shaped semiconductor region (1). and the substance (30) to be sensed can influence the electrical properties of the strip-shaped semiconductor region (1), and wherein the strip-shaped semiconductor region (1) is formed in a semiconductor layer (13) on top of an insulating layer (5) which in turn is on top of a semiconductor substrate (14). According to the invention after formation of the strip-shaped semiconductor region (1) in the semiconductor layer (13), the substrate (2) is attached to the part of the semiconductor body (11) comprising the strip-shaped semiconductor region (1) at a side opposite to the semiconductor substrate (14), whereinafter the semiconductor substrate (14) is at least partially and preferably completely removed and subsequently an opening (6) is formed in the insulating layer (5) at the location of the strip- shaped semiconductor region (1). This method is suitable for mass scale production and protects the parts of the device (10) that are prone to damage caused by the fluid (20).

Description

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AI Technical Summary

Benefits of technology

This patented process allows for easy handling of small electronic components like silicone pressure sensitive switches on chips during manufacturing processes without damaging them. It achieves these technical benefits through removing certain parts from the wafer before bonding with another material called an adhesive tape. Additionally, there are methods described where the openings at one edge of each part allow fluids to enter while still being protected against damage caused by external factors. Overall, this new technique makes possible efficient use of space within integrated circuit packages.

Problems solved by technology

This technical problem addressed in this patented text describes how current methods have limitations when producing large numbers of small electronic components like transistors due to their fragility during manufacturing processes. Additionally, these techniques may cause harm even at low levels of concentration caused by liquid containing them.

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