Apparatus and method for providing, bonding drive circuit board and cassette case thereof

A technology for driving circuit boards and equipment, applied in the directions of printed circuit components, circuit inspection/identification, electrical components, etc., can solve problems such as adhesion, head breakage, and productivity reduction

Inactive Publication Date: 2009-10-14
SFA ENG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that when a large torque is applied to the head of the bolt part shape, the head breaks
Therefore, there is a problem that the productivity is lowered because the inspection process makes the production interval longer
Therefore, there is a problem that it is not possible to attach many TCPs per unit time

Method used

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  • Apparatus and method for providing, bonding drive circuit board and cassette case thereof
  • Apparatus and method for providing, bonding drive circuit board and cassette case thereof
  • Apparatus and method for providing, bonding drive circuit board and cassette case thereof

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Embodiment Construction

[0070] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The aspects and features of the present invention and methods for achieving the aspects and features will be understood by referring to the embodiments to be described in detail by referring to the drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. The matters defined in the description (for example, specific construction and elements) are only specific details provided to help those of ordinary skill in the art to fully understand the present invention, and the present invention is only defined within the scope of the appended claims. Throughout the description of the present invention, the same drawing reference numerals are used to refer to the same elements in the various figures.

[0071] Hereinafter, the substrate may be any substrate usable for flat p...

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PUM

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Abstract

The invention discloses an apparatus for providing drive circuit board and cassette case thereof, bonding apparatus and bonding method of drive circuit board, and bonding system of drive circuit board comprising the bonding apparatus. Bonding apparatus of drive circuit board includes a compression unit for compressing the drive circuit board onto bonding surface attached with underlay of drive circuit board, wherein the compression unit includes a compression body provided for closing to bonding surface on top of the underlay and separating from the bonding surface; a bonding tool comprising a pressure surface, when the drive circuit is compressec onto the bonding surface, the pressure surface contacting with the drive circuit board; a plurality of height regulation components for regulating displacement of the pressure surface relative to the bonding surface to obtain planarity of pressure surface of the bonding tool; and rotation regulation parts provided on the height regulation components for regulating rotation of the height regulation component and provided on a area between the compression body and the bonding tool of the height regulation component.

Description

[0001] The present invention is a divisional application of the invention patent application with the application date of June 7, 2007, the application number of 200710108656.5, and the invention title of "equipment and method for supplying and joining drive circuit boards and its box-type casing" technical field [0002] The present invention relates to a device for supplying a drive circuit board and a cassette case thereof, a bonding device for a drive circuit board and a bonding method thereof, and a bonding system for a drive circuit board having the bonding device, And more specifically, to an apparatus for supplying a driving circuit board and a cassette case thereof, a bonding apparatus for a driving circuit board and a bonding method thereof, and a production tact capable of shortening a bonding process time) bonding system with the drive circuit board of the bonding device. Background technique [0003] A flat panel display panel is an image display element that re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/133G09F9/00H05K13/04G02F1/13H01J11/20
CPCH05K1/0269H05K13/0015H05K13/02H05K13/0408
Inventor 徐志源朴永根朴丙敞金万济安廷祐朴赞庆白永焕陈明出
Owner SFA ENG CORP
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