Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating

A technology of high thermal conductivity ceramics and production methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, printed circuits, and printed circuit manufacturing. It can solve problems such as unsatisfactory thermal conductivity, poor dimensional stability, and complicated processing technology. Achieve the effect of good heat conduction and heat dissipation, good surface compactness and simple processing technology

Inactive Publication Date: 2010-04-28
广东达进电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, traditional lighting generally uses incandescent lamps or fluorescent lamps, in which incandescent lamps consume a lot of energy and have weak luminous efficacy; fluorescent lamps contain mercury, which is not environmentally friendly, and their energy consumption is relatively large, and their luminous efficacy is relatively weak
In order to solve this problem, people invented light-emitting LEDs, but in practical applications, only about 20% of the existing light-emitting LEDs produce light for every 100% of energy, while 80% of the energy is turned into heat energy loss, so heat is the largest energy consumption , but at the same time, if the excess heat energy is not removed, the service life of the LED will be reduced
The heat dissipation of LED is mainly through its packaging substrate, but as the packaging substrate becomes smaller and smaller, the heat generated by the LED cannot be effectively dissipated. At present, FR4 material or resin with ceramic

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A kind of bright copper surface of the present invention and can locate the production method of high thermal conductivity ceramic circuit board, it comprises the following steps:

[0034] a. Pretreatment of the substrate

[0035] Mainly include: incoming material inspection → degreasing → pickling → electroplating copper → cleaning → drying and other processes;

[0036] The specific method is: clean the surface of the qualified ceramic copper-clad substrate, use sodium persulfate to micro-etch the copper-clad layer of the ceramic copper-clad substrate, and remove the oil stains and surface oxides on the copper-clad layer, which is relatively It is more effective to prevent damage to the ceramic copper-clad substrate when using physical methods to clean the circuit board substrate, because the physical method is generally to first press the substrate tightly, and then use the roller brush to rotate at high speed on its surface, and the substrate is cleaned by the roller...

Embodiment 2

[0057] A kind of bright copper surface of the present invention and can locate the production method of high thermal conductivity ceramic circuit board, it comprises the following steps:

[0058] a. Pretreatment of the substrate

[0059] Mainly include: incoming material inspection → degreasing → pickling → electroplating copper → cleaning → drying and other processes;

[0060] The specific method is to clean the surface of the qualified ceramic copper-clad substrate. The specific method is to use sodium persulfate to micro-etch the copper-clad layer of the ceramic copper-clad substrate to remove oil stains and surface oxides on the copper-clad layer. , which is more effective in preventing damage to the ceramic copper-clad substrate than using physical methods to clean the circuit board substrate, because the physical method generally first compresses the substrate, and then uses a roller brush to rotate at high speed on its surface. The brush rubs against the surface of the...

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PUM

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Abstract

The invention discloses a production method of a bright-copper-face high-heat-conductivity ceramic circuit board capable of locating, which comprises the following steps: (a) pretreating a base board; (b) transferring a pattern; (c) making a locating hole; (d) printing solder-resisting ink; (e) screen-printing the text; (f) chemically depositing nickel and gold; (g) and forming by cutting. The invention aims to overcome the defects in the prior art and provide a production method of the bright-copper-face high-heat-conductivity ceramic circuit board capable of locating. The invention has the advantages of simple technique and favorable effects of heat conduction and dissipation of the product.

Description

technical field [0001] The invention relates to a production method of a ceramic circuit board with a bright copper surface and a positionable high thermal conductivity. Background technique [0002] With the continuous development of science and technology and the continuous improvement of people's material and spiritual civilization, people's development of electronic products is increasingly energy-saving and environmentally friendly. For example, traditional lighting generally uses incandescent lamps or fluorescent lamps, in which incandescent lamps consume a lot of energy and have weak luminous efficacy; fluorescent lamps contain mercury, are not environmentally friendly, and their energy consumption is relatively large, and their luminous efficacy is relatively weak. In order to solve this problem, people invented light-emitting LEDs, but in practical applications, only about 20% of the existing light-emitting LEDs produce light for every 100% of energy, while 80% of t...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
Inventor 王斌陈华巍姚静宇盛从学
Owner 广东达进电子科技有限公司
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