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2results about How to "Improve surface compactness" patented technology

Method for improving interface connection performance between filling layer and track plate

ActiveCN115948942BImprove surface compactnessSolve the problem of relatively large water ashClimate change adaptationBallastwayTrackwayCement slurry
This invention discloses a method for improving the interfacial bonding performance between the filler layer and the track slab, comprising: preparing a release cloth of the same size as the bottom plate of the track slab and capable of permeating and absorbing cement slurry on both sides; after vibrating and leveling the track slab concrete, laying the release cloth flat on the bottom of the track slab, allowing the slurry-rich layer on the surface of the track slab concrete to permeate into the release cloth, forming a dense cement slurry layer with strong adhesion; laying, fine-tuning, and sealing the bottom of the track slab with the release cloth bonded to it, and then pouring self-compacting concrete. During the pouring of the self-compacting concrete, the internal floating slurry permeates to the release cloth bonded to the bottom surface of the track slab, some of the water in the slurry is absorbed and evaporated by the release cloth, and the floating air bubbles are absorbed and broken at the release cloth, thereby increasing the density of the upper surface of the self-compacting concrete and forming a strongly bonded air bubble and water seepage slurry absorption layer with the release cloth. This invention can effectively improve the interfacial bonding performance between the filler layer and the track slab, and extend the service life of the track structure.
Owner:RAILWAY CONSTR RES INST OF CHINA ACAD OF RAILWAY SCI CO LTD +3

Light emitting diode and preparation method thereof

The invention provides a light emitting diode and a preparation method thereof. The light-emitting diode comprises an epitaxial structure, an electrode structure and a passivation layer, the passivation layer covers the epitaxial structure, and the electrode structure penetrates through the passivation layer and is electrically connected with the epitaxial structure. The passivation layer comprises a first passivation sub-layer and a second passivation sub-layer, the first passivation sub-layer is a silicon-aluminum oxide layer, the second passivation sub-layer is a silicon oxide layer, the surface compactness of the first passivation sub-layer formed by silicon-aluminum oxidation is good, and the first passivation sub-layer serves as a buffer layer of the second passivation sub-layer, so that the deposition quality of the subsequently grown second passivation sub-layer is greatly improved; the second passivation sub-layer formed by the oxide of silicon is an amorphous thin film, is compact, has no defects, is stable in property, and is favorable for isolating water vapor. The double passivation layers are good in coating effect, uniform and compact in film quality and good in moisture resistance and corrosion resistance, the stability of the internal structure of an LED device in a high-humidity environment is greatly improved, and the LED yield is improved.
Owner:BOE HUACAN OPTOELECTRONICS (GUANGDONG) CO LTD