Method for producing high thermal conductivity ceramic circuit board

A technology of high thermal conductivity ceramics and production methods, applied in printed circuits, chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, etc., can solve problems such as unsatisfactory thermal conductivity, reduced service life of LEDs, poor dimensional stability, etc. , to achieve good heat conduction and heat dissipation effects, prevent fracture damage, and good surface compactness

Inactive Publication Date: 2010-04-28
广东达进电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, traditional lighting generally uses incandescent lamps or fluorescent lamps, in which incandescent lamps consume a lot of energy and have weak luminous efficacy; fluorescent lamps contain mercury, which is not environmentally friendly, and their energy consumption is relatively large, and their luminous efficacy is relatively weak
In order to solve this problem, people invented light-emitting LEDs, but in practical applications, only about 20% of the existing light-emitting LEDs produce light for every 100% of energy, while 80% of the energy is turned into heat energy loss, so heat is the largest energy consumption , but at the same time, if the excess heat energy is not removed, the service life of the LED will be reduced
The heat dissipation of LED is mainly through its packaging substrate, but as the packaging substrate becomes smaller and smaller, the heat generated by the LED cannot be effectively dissipated. At present, FR4 material or resin with ceramic

Method used

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Examples

Experimental program
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Example Embodiment

[0035] Example 1

[0036] The production method of a high thermal conductivity ceramic circuit board of the present invention includes the following steps:

[0037] a. Pretreatment of the substrate

[0038] Mainly include: incoming inspection → degreasing → micro-etching → pickling → copper electroplating → cleaning → drying and other processes;

[0039] The specific method is: clean the surface of the ceramic copper clad substrate that has passed the inspection, and use sodium persulfate or ammonium persulfate to microetch the copper clad layer of the ceramic copper clad substrate to remove oil stains and surface oxidation on the copper clad layer Compared with the use of physical methods to clean the circuit board substrate, this is more effective in preventing damage to the ceramic copper-clad substrate, because the physical method is generally to first compress the substrate, and then use a roller brush to rotate at high speed on its surface. The friction of the roller brush on t...

Example Embodiment

[0059] Example 2

[0060] The production method of a high thermal conductivity ceramic circuit board of the present invention includes the following steps:

[0061] a. Pretreatment of the substrate

[0062] Mainly include: incoming inspection → degreasing → micro-etching → pickling → copper electroplating → cleaning → drying and other processes;

[0063] The specific method is to clean the surface of the ceramic copper clad substrate that has passed the inspection. The specific method is to use sodium persulfate or ammonium persulfate to microetch the copper clad layer of the ceramic copper clad substrate to remove the oil and dirt on the copper clad layer. The oxide on the surface is more effective than the physical method used to clean the circuit board substrate, which is more effective in preventing damage to the ceramic copper-clad substrate, because the physical method is generally to first compress the substrate, and then use a roller brush on its surface at high speed Rotatio...

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PUM

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Abstract

The invention discloses a method for producing a high thermal conductivity ceramic circuit board, which comprises the following steps: a, pre-processing of a substrate; b, pattern transfer; c, manufacturing of conducting holes; d, printing of solder mask; e, silk screen printing of characters; f, chemical deposition of nickel, gold; and g, formation by cutting; the objective of the invention is to overcome the deficiencies in the prior art and provide a method for producing a high thermal conductivity ceramic circuit board with simple technology and good thermal conduction and radiating effects of the product.

Description

technical field [0001] The invention relates to a production method of a high thermal conductivity ceramic circuit board. Background technique [0002] With the continuous development of science and technology and the continuous improvement of people's material and spiritual civilization, people's development of electronic products is increasingly energy-saving and environmentally friendly. For example, traditional lighting generally uses incandescent lamps or fluorescent lamps, in which incandescent lamps consume a lot of energy and have weak luminous efficacy; fluorescent lamps contain mercury, are not environmentally friendly, and their energy consumption is relatively large, and their luminous efficacy is relatively weak. In order to solve this problem, people invented light-emitting LEDs, but in practical applications, only about 20% of the existing light-emitting LEDs produce light for every 100% of energy, while 80% of the energy is turned into heat energy loss, so he...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
Inventor 王斌陈华巍姚静宇盛从学
Owner 广东达进电子科技有限公司
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