Method for producing high thermal conductivity ceramic circuit board
A technology of high thermal conductivity ceramics and production methods, applied in printed circuits, chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, etc., can solve problems such as unsatisfactory thermal conductivity, reduced service life of LEDs, poor dimensional stability, etc. , to achieve good heat conduction and heat dissipation effects, prevent fracture damage, and good surface compactness
Inactive Publication Date: 2010-04-28
广东达进电子科技有限公司
0 Cites 8 Cited by
AI-Extracted Technical Summary
Problems solved by technology
View more
Method used
View more
Abstract
The invention discloses a method for producing a high thermal conductivity ceramic circuit board, which comprises the following steps: a, pre-processing of a substrate; b, pattern transfer; c, manufacturing of conducting holes; d, printing of solder mask; e, silk screen printing of characters; f, chemical deposition of nickel, gold; and g, formation by cutting; the objective of the invention is to overcome the deficiencies in the prior art and provide a method for producing a high thermal conductivity ceramic circuit board with simple technology and good thermal conduction and radiating effects of the product.
Application Domain
Conductive material chemical/electrolytical removal
Technology Topic
Solder maskThermal conductivity +5
Examples
- Experimental program(2)
Example Embodiment
Example Embodiment
PUM


Description & Claims & Application Information
We can also present the details of the Description, Claims and Application information to help users get a comprehensive understanding of the technical details of the patent, such as background art, summary of invention, brief description of drawings, description of embodiments, and other original content. On the other hand, users can also determine the specific scope of protection of the technology through the list of claims; as well as understand the changes in the life cycle of the technology with the presentation of the patent timeline. Login to view more.
Similar technology patents
Preparation method of high-whiteness thermosensitive color developing agent containing sulfonylurea structure
PendingCN114105833APrevent oxidation and discolorationGuaranteed yield
Owner:HEBEI JIANXIN CHEM IND CO LTD
Board splicing process and device for circuit board production
Owner:LONGNAN JUNYA ELECTRONICS TECH CO LTD
Improved multilayer circuit board and manufacturing method thereof
Owner:DIGITAL PRINTED CIRCUIT BOARD CO LTD
Magnetic core assembly method and system for magnetic card magnetic head
Owner:BEIJING TECH MAGNETIC RECORD MAKING
Method for manufacturing high-heat conduction ceramic circuit board
InactiveCN101699931Aavoid breakage damageGuaranteed Yield
Owner:广东达进电子科技有限公司
Multifunctional recombination machine
InactiveCN105667049AGuaranteed yieldAvoid Bad Questions
Owner:SUZHOU JINHE NEW MATERIAL
Classification and recommendation of technical efficacy words
- avoid breakage damage
- Guaranteed Yield
Method for manufacturing high-heat conduction ceramic circuit board
InactiveCN101699931Aavoid breakage damageGuaranteed Yield
Owner:广东达进电子科技有限公司