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Preparation method of ceramic-based electronic substrate material

An electronic substrate and ceramic-based technology, applied in the field of preparation of ceramic-based electronic substrate materials, can solve the problems of good surface compactness, high bending strength, moisture-absorbing electrode slurry, etc., and achieve simple preparation steps, good sintering performance, The effect of high bending strength

Inactive Publication Date: 2016-12-14
郭迎庆
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation steps of the invention are simple, the sintering performance of the obtained product is good, no pores are generated during sintering, the material has high bending strength and good surface compactness, and effectively solves the problems of moisture absorption and infiltration of electrode slurry.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0015] First, weigh 2g of yttrium nitrate, 1g of calcium nitrate, 100g of aluminum nitrate, and 15g of glucose, add them into 80mL of deionized water, and disperse them with a 300W ultrasonic wave for 15min to obtain a mixed solution. The mixed solution is dried in an oven at 120°C until it reaches a constant weight. Put the dried powder into a tube furnace, control the temperature at 600°C, and calcine it for 1 hour under a carbon monoxide atmosphere, then transfer it to a vacuum sintering furnace, and feed nitrogen with a volume ratio of 19:1 at a rate of 1 L / min. Hydrogen mixed gas, and heated to 1300°C for sintering and nitriding for 3 hours, cooled to room temperature to obtain nano-aluminum nitride; Put it into a ball mill tank, add 30mL of absolute ethanol, place it in a ball mill, and mill it at 300r / min for 30min, then add 90g of the above-mentioned nano-aluminum nitride, and continue ball milling for 2h to obtain a composite slurry; then put the above composite slurry...

example 2

[0018] First, weigh 3g of yttrium nitrate, 2g of calcium nitrate, 110g of aluminum nitrate, and 18g of glucose, add them into 90mL of deionized water, and disperse them with a 300W ultrasonic wave for 18min to obtain a mixed solution, which is then dried in an oven at 125°C until constant weight. Put the dried powder into a tube furnace, control the temperature at 650°C, and calcine it for 2 hours under a carbon monoxide atmosphere, then transfer it to a vacuum sintering furnace, and feed nitrogen with a volume ratio of 19:1 at a rate of 2L / min. Hydrogen mixed gas, and heated to 1450°C for sintering and nitriding for 4h, cooled to room temperature to obtain nano-aluminum nitride; Put it into a ball mill tank, add 40mL of absolute ethanol, put it in a ball mill, and mill it at 300r / min for 35min, then add 91g of the above-mentioned nano-aluminum nitride, and continue ball milling for 3h to obtain a composite slurry; then put the above composite slurry in Dry it in a drying oven...

example 3

[0021]First, weigh 3g of yttrium nitrate, 2g of calcium nitrate, 120g of aluminum nitrate, and 20g of glucose, add them into 100mL of deionized water, and disperse them with a 300W ultrasonic wave for 20min to obtain a mixed solution, which is dried in an oven at 130°C until constant weight. Put the dried powder into a tube furnace, control the temperature at 700°C, and calcine it for 2 hours in a carbon monoxide atmosphere, then transfer it to a vacuum sintering furnace, and feed nitrogen with a volume ratio of 19:1 at a rate of 2L / min. Hydrogen mixed gas, and heated to 1600°C for sintering and nitriding for 4 hours, cooled to room temperature to obtain nano-aluminum nitride; Put it into a ball mill tank, add 50mL of absolute ethanol, place it in a ball mill, and mill it at 300r / min for 40min, then add 92g of the above-mentioned nano-aluminum nitride, and continue ball milling for 3h to obtain a composite slurry; then put the above composite slurry in Dry it in a drying oven ...

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PUM

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Abstract

The invention discloses a preparation method of a ceramic-based electronic substrate material, and belongs to the technical field of the preparation of ceramic substrate materials. The method comprises the following steps: mixing and ultrasonically dispersing yttrium nitrate and calcium nitrate, drying to constant weight, sintering and nitriding to prepare nanometer aluminum nitride, mixing with dehydrated and milled samarium nitrate, carrying out ball milling, drying to constant weight, grinding, screening and then calcining, mixing with the paraffin, extruding and pelleting, drily pressing to prepare a blank body, degumming, and sintering to obtain the ceramic-based electronic substrate material. The method disclosed by the invention has the beneficial effects that the preparation step is simple, the obtained product is good in sintering performance, the pore is avoided in the sintering, the material flexure strength is high; the surface compactness is good, and the phenomena of moisture absorption and electrode slurry penetration are avoided.

Description

technical field [0001] The invention relates to a method for preparing a ceramic-based electronic substrate material, and belongs to the technical field of ceramic substrate material preparation. Background technique [0002] Substrate materials mainly play the role of semiconductor chip support, heat dissipation, protection, insulation and interconnection with external circuits in electronic packaging. With the development of electronic packaging technology towards high frequency, high speed, multi-function, high performance, small size and high reliability, electronic packaging substrate materials are playing an increasingly important role in the new generation of electronic packaging materials. Science and industry have put forward higher requirements for electronic packaging substrate materials, and at the same time promoted the rapid development of electronic packaging substrate materials. Ceramic substrate refers to copper foil directly bonded to alumina (Al 2 o 3 )...

Claims

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Application Information

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IPC IPC(8): C04B35/582C04B35/581C04B35/634C04B35/622
CPCC04B35/581C04B35/622C04B35/63496C04B2235/3208C04B2235/3217C04B2235/3224C04B2235/3225C04B2235/96C04B2235/9607
Inventor 郭迎庆盛海丰王龙
Owner 郭迎庆
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