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LED illuminating apparatus and manufacture method thereof

A technology of LED lighting and LED chips, applied in lighting devices, lighting device parts, lighting and heating equipment, etc., can solve the problems of large glare, high center brightness, uncomfortable eyes, etc. Glare reduction effect

Inactive Publication Date: 2009-11-04
赵捷
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing LED lighting devices are usually made of white LEDs that have been packaged and molded (currently mainly DIP LEDs and SMD LEDs). The lighting device made of this technology has a high center brightness of the LED and the center of the LED The distance between them is relatively large (greater than 6mm), so that the light emitted by the lamps is a bright spot one by one, and the center brightness is very high, and the glare is very large, which makes people's eyes feel very uncomfortable.

Method used

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  • LED illuminating apparatus and manufacture method thereof
  • LED illuminating apparatus and manufacture method thereof
  • LED illuminating apparatus and manufacture method thereof

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Embodiment Construction

[0017] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0018] see figure 1 , is an LED lighting device provided by an embodiment of the present invention, and the LED lighting device includes: a substrate with a circuit 10, and the substrate with a circuit 10 may be a substrate made of aluminum material (referred to as an aluminum substrate with a circuit). At least two LED chips 20 are fixed on the substrate 10 with circuits, and the distance d between every two LED chips 20 satisfies 2mm<d<6mm. Glue injection holes 30 and air outlet holes 40 are opened on the substrate 10 with circuits. The positive and negative po...

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Abstract

The invention is applicable to the field of semi-conductor device and provides an LED illuminating apparatus and a manufacture method thereof. The LED illuminating apparatus comprises a substrate provided with a circuit, the substrate provided with the circuit is fixed with at least two LED chips with the interval being 2-6mm, the anode and cathode of each LED chip are electrically connected with the circuit of the substrate provided with the circuit by a conduction wire, and transparent covers containing fluorescent substance are fixed above each LED chip. In the invention, ligthspot is eliminated and glare is reduced, thus ensuring the light of the LED illuminating apparatus is very gentle.

Description

technical field [0001] The invention belongs to the field of semiconductor devices, in particular to an LED lighting device and a manufacturing method thereof. Background technique [0002] Existing LED lighting devices are usually made of white LEDs that have been packaged and molded (currently DIP LEDs and SMD LEDs are mainly used). The lighting devices made of this technology have high brightness in the center of the LED and the gap between the LEDs The distance between them is large (greater than 6mm), so that the light emitted by the lamps is a bright spot one by one, and the center brightness is very high, and the glare is very large, which makes people's eyes feel very uncomfortable. Contents of the invention [0003] The technical problem to be solved by the embodiments of the present invention is to provide an LED lighting device with low glare and no bright spots and a manufacturing method thereof. [0004] In order to solve the above-mentioned technical problem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V23/00F21V9/10H01L33/00F21Y101/02F21K9/23F21K9/238F21K9/90F21V9/40F21Y113/13F21Y115/10
Inventor 赵捷
Owner 赵捷