Measuring method of power consumption of chip
A measurement method and chip technology, applied in the direction of electric power measurement by thermal method, can solve problems such as difficulty, difficulty in measuring voltage and current, and unsuitable for chip power consumption testing, and achieve the effect of chip power consumption.
Inactive Publication Date: 2009-12-09
优仪半导体设备(深圳)有限公司
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Problems solved by technology
[0002] The commonly used chip power consumption test method is to test the power supply voltage and current of the chip, and then calculate the power consumption of the chip. However, this commonly used chip power consumption test method is difficult to measure voltage and current, such as BGA packaging or multi-voltage It is very difficult to directly measure the voltage and current data of the power supply chip
Therefore, the commonly used chip power consumption test method is not suitable for the power consumption test of this type of chip.
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[0026] Take the electronic switch chip PM8385 of PMC-Sierra, Inc as an example, its thermal resistance coefficient θ jA In the absence of wind, it is 32.48℃ / W, θ jB (Representing the thermal resistance coefficient of the chip from the junction to the bottom of the chip) is 23.7℃ / W, θ jT (I.e. θ in the above jC ) Is 8.5°C / W.
[0027] then
[0028] α = θ jB θ jB + θ jT = 0.736
[0029] Under the application conditions that basically comply with the JEDEC standard, the case temperature T of the chip is measured C Is 61°C, chip ambient temperature T A It is 32.2°C, and the chip ambient temperature refers to the air temperature around the chip when the chip is working.
[0030] then
[0031] P = T ...
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The invention relates to a measuring method of the power consumption of a chip, comprising the following steps: arranging an application scene of a chip to be measured into an environment which conforms to or is similar to a JEDEC standard environment; enabling the chip to be measured to be electrified and work for a certain time so as to know that the chip to be measured works stably; respectively measuring the shell temperature and the surrounding air environment temperature of the chip to be measured; substituting the measured shell temperature and the measured surrounding air environment temperature of the chip to be measured into the following formula; and calculating the power consumption of the chip to be measured. P=(TC-TA) / (theta jA-theta jC*alpha), wherein the theta jA, the theta jC and the alpha stand for intrinsic parameters of the chip and can be supplied by chip data or a chip supplier, the TC stands for the shell temperature of the chip, and the TA stands for the surrounding air environment temperature of the chip. The measuring method can obtain the power consumption of the chip by only measuring the shell temperature and the surrounding air environment temperature of the chip in a working process without measuring the voltage and the current of the chip.
Description
Technical field [0001] The invention relates to a measuring method for measuring the dissipation power consumption of a chip, in particular to a measuring method for the power consumption of a chip with a small output power relative to the total power. Background technique [0002] The commonly used chip power consumption test method is to test the power supply voltage and current of the chip, and then calculate the power consumption of the chip. However, this common chip power consumption test method is difficult to measure the voltage and current, such as BGA packaging or multi-voltage It is very difficult for the power supply chip to directly measure its voltage and current data. Therefore, commonly used chip power consumption testing methods are not suitable for power consumption testing of such chips. Summary of the invention [0003] The purpose of the present invention is to overcome the above-mentioned problems and provide the society with a measurement method that avoid...
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Inventor 邓顶阳陈志辉
Owner 优仪半导体设备(深圳)有限公司