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Display panel and display device

A technology of display panel and display area, used in instruments, nonlinear optics, optics, etc.

Active Publication Date: 2011-05-04
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the increasing functional requirements of the display panel 100, the design of the driver chip 130 is gradually becoming more complicated. In consideration of the cost of not increasing the number of driver chips 130, it may be necessary to increase the number of driving circuits of each driver chip 130, so , will result in a reduction in the pitch CP of the external pads 132
When the pitch CP of the external pads 132 is reduced to a certain extent and they are too close to each other, the external pads 132 are likely to overlap each other during formation to cause a short circuit.

Method used

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  • Display panel and display device
  • Display panel and display device
  • Display panel and display device

Examples

Experimental program
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Embodiment Construction

[0076] figure 2 is a schematic diagram of a display device 500 according to an embodiment of the present invention. Please refer to figure 2 , the display device 500 includes a display panel 200 and at least one driving element 520 . The display panel 200 is, for example, a liquid crystal display panel, and the driving element 520 is electrically connected to a plurality of external pads 222 of the corresponding display panel 200 , wherein the driving element 520 has a driving chip 530 . In this embodiment, the driving element 520 is, for example, a tape carrier package (TCP) packaging structure, and the display device 500 further includes a circuit board 510 , and the driving element 520 is electrically connected to the circuit board 510 . In another embodiment, the driving element 520 may also be a chip-on-film (COF) packaging structure.

[0077] It should be noted that the present invention does not limit the manner of electrical connection between the driving chip and...

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Abstract

The invention discloses a display panel and a display device. The display panel is provided with a display district, at least a fan-out district and an external circuit district, wherein the external circuit district is located at the periphery of the display district, and the fan-out district is located between the display district and the external circuit district. The display panel comprises aplurality of pixel structures and at least one pull wire group, wherein each pull wire group comprises a plurality of external connection pads, a plurality of internal nodes, a plurality of transit points, a plurality of main pull wires and a plurality of connection wires; and the main pull wires are arranged in the fan-out district and are connected among the transit points and the correspondinginternal nodes. The space between any two adjacent external connection pads is CP1, the space between any two adjacent internal nodes is CP2, the space between any two adjacent transit points is PM, CP1 (max) is less than CP2 and more than or equal to PM, and PM is more than or equal to CP1 (min), wherein the CP1 (max) is the maximum of the CP1, and the CP1 (min) is the minimum of the CP1.

Description

technical field [0001] The present invention relates to a display panel and a display device, and in particular to a display panel and a display device with good impedance matching. Background technique [0002] Due to the high image resolution requirements of liquid crystal displays and the trend of thinner, lighter and smaller, the drive circuit construction technology on the liquid crystal display panel has gradually changed from chip-on-board bonding technology (Chip On Board, COB) to automatic film laminating technology ( Tape Automated Bonding (TAB), and then evolved into Chip On Film (COF) bonding technology with fine pitch between pins and Chip On Glass (COG) bonding technology. Among them, die-on-film bonding technology and chip-on-glass bonding technology are high pin count packaging technologies, which can reduce the amount of drive circuits themselves and circuit boards for serial connection. Therefore, chip-on-film bonding technology and glass-on-chip Die bondi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
Inventor 傅建豪李敏勤江明峰黄峻维
Owner AU OPTRONICS CORP