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Conformal coating comprising binder and non-conductive particulate

A technology of conformal coating and bonding layer, which is applied in the direction of reinforcement, coating, and circuit of conductive graphics, and can solve the problems of reducing conductive crystal structure or growth of whiskers

Inactive Publication Date: 2010-02-17
FISHER CONTROLS INT LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned above, even though conventional conformal coatings may be relatively rigid, studies have shown that they are not rigid enough to reduce conductive crystal structures or whisker growth

Method used

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  • Conformal coating comprising binder and non-conductive particulate
  • Conformal coating comprising binder and non-conductive particulate
  • Conformal coating comprising binder and non-conductive particulate

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Embodiment Construction

[0019] While the invention has been described and disclosed in connection with certain embodiments, this specification is not intended to limit the invention to the specific embodiments shown and described herein, but the invention is intended to cover all within the spirit and scope of the invention Alternative embodiments and modifications, the spirit and scope of the invention are defined by the claims included herein and the equivalents of the invention disclosed and described. Conformal coatings according to embodiments of the present disclosure can protect device components from, for example, moisture, fungus, dust, erosion, abrasion, and other environmental stresses. The conformal coating is suitable for many shapes, such as cracks, holes, points, sharp edges, and points or planes. In general, conformal coatings made in accordance with the teachings of the present invention have been found to impart shielding to the substrate and / or any connecting elements from the grow...

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Abstract

A conformal coating comprises a binding layer and a particulate which provides shielding against conductive crystalline structure growth. The particulate comprises materials that provide a tortuous path to substantially inhibit the grow of conductive crystalline structure on electrically conductive surfaces.

Description

technical field [0001] The present invention generally relates to a substrate conformal coating, and more particularly, to an improved conformal coating for substantially suppressing the effects of metal crystal structure growth produced by substantially lead-free type conductive coatings on electronic devices. Background technique [0002] Conformal coatings are typically coating materials applied to substrates such as electronic devices or electronic circuits to provide protection against environmental contamination such as moisture, dust, chemicals and extreme temperatures. In addition, it is generally understood that a properly selected conformal coating can reduce mechanical stress on an electronic device, thereby substantially reducing peeling or separation of components connected to the electronic device. Selection of an appropriate coating material is generally based on the following criteria: the type of exposure or contamination that the substrate or device will ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D201/00H01L21/288H05K3/24C08J7/04
CPCH05K2201/0209H05K3/244H05K3/285H05K2201/0769
Inventor 克莱德·托马斯·艾森拜斯埃里克·W·斯特朗
Owner FISHER CONTROLS INT LLC
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