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Three-dimensional nanometer-grade cutting simulation method based on molecular dynamics

A molecular dynamics, three-dimensional nanotechnology, applied in the direction of nanotechnology, nanotechnology, nanostructure manufacturing, etc., can solve the problems of measurement and calculation limit, no research report on 3D tool simulation model, etc., to achieve effective cutting process The effect of the result

Inactive Publication Date: 2010-02-24
TIANJIN UNIV
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Problems solved by technology

[0004] At present, the MD simulation mainly focuses on the analysis of force, temperature distribution, different tool rake angles, different cutting edge radii, temperature changes and other related aspects during the cutting process. However, due to the limitations of tool measurement and calculation, no significant Research report on establishing a 3D tool simulation model that is more consistent with actual machining

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  • Three-dimensional nanometer-grade cutting simulation method based on molecular dynamics
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  • Three-dimensional nanometer-grade cutting simulation method based on molecular dynamics

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Embodiment Construction

[0025] The present invention will be described in further detail below according to the embodiments and the accompanying drawings.

[0026] During molecular dynamics cutting simulation, the workpiece and tool must be arranged according to the rules of atomic composition.

[0027] Using the Fortran language, it is relatively easy to construct solid models of large blocks of diamond and single crystal silicon. In this model, each atom is composed of its three-dimensional point information. In layman's terms, it is to use three numbers accurate to three digits after the decimal point, and the unit is Angstrom, to represent the position of the atom in three dimensions, that is, its space coordinates, and thus determine the position of the atom in space. A typical cutting model can be constructed by further dividing the types of atoms and the shape of entities.

[0028] In order to facilitate the reading of data and the integrity of data information in the next step, most of the ...

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Abstract

The invention belongs to the field of nanometer-level ultra-precise processing, in particular to a three-dimensional nanometer-grade cutting simulation method based on molecular dynamics. The method comprises the following steps: (1) establishing a three-dimensional model of a cutter and a working piece; (2) confirming a potential energy function; and (3) performing the three-dimensional nanometer-grade cutting simulation. The three-dimensional model is closer to a practical single-point diamond cutter in shape, thereby more effectively simulating the practical cutting process and more trulypresenting the nanometer-grade cutting mechanism.

Description

technical field [0001] The invention belongs to the field of nano-scale ultra-precision machining, and relates to a three-dimensional nano-cutting simulation method. Background technique [0002] Ultra-precision machining and nano-machining technologies, which are at the forefront of modern manufacturing technology, can reach the nanometer level or even the atomic level with the continuous improvement of machining accuracy. There are some physical phenomena in the machining process, such as tool micro wear, scale effect, etc. These phenomena cannot be explained by the traditional cutting theory based on continuum mechanics. But this process can be simulated intuitively by molecular dynamics, and molecular dynamics simulation (Molecular Dynamics Simulation) can be used to calculate this cutting process, which is a powerful computer simulation method that connects the microcosm and the macrocosm. At the same time, it is not limited by processing equipment and processing condi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B82B3/00G06F17/50
Inventor 房丰洲张治国
Owner TIANJIN UNIV
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