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Chip on film type semiconductor package and display device

A thin-film-on-chip and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices, etc., can solve problems such as halving heat dissipation efficiency

Active Publication Date: 2013-03-27
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This separation halves the cooling efficiency by breaking the heat dissipation channel through which the heat generated by the semiconductor device is dissipated through the insulating substrate, heat sink panel and chassis

Method used

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  • Chip on film type semiconductor package and display device
  • Chip on film type semiconductor package and display device
  • Chip on film type semiconductor package and display device

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Embodiment Construction

[0049] Now, the concept of the present invention will be more fully described with reference to the accompanying drawings, in which exemplary embodiments of the present invention concept are shown. However, the inventive concept can be implemented in many different forms, and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the disclosure will be thorough and complete, and the concept of the inventive concept Completely convey to those of ordinary skill in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity. The same reference numerals denote the same elements in the drawings, and therefore, their description will be omitted.

[0050] Figure 1A It is a cross-sectional view of a chip-on-film (COF) type semiconductor device (for example, a COF type semiconductor package) having a heat dissipation member 17 according to an embodiment of the inventive concept. ...

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Abstract

To provide a COF type semiconductor package including a heat dissipating member by which a heat dissipation effect improves, and the heat dissipation member can be stably fixed and maintained to an electronic device for a long period. The COF type semiconductor package may include an insulation substrate with flexibility, a semiconductor device disposed on the top surface of the insulation substrate, a heat dissipating component disposed on the bottom surface of the insulation substrate, and an adhesive component for adhering between the bottom surface of the insulation substrate and the heatdissipating component, and a pressure absorption area capable of absorbing external pressure is formed between the bottom surface of the insulation substrate and the heat dissipating component.

Description

[0001] This application requires Korean Patent Application No. 10-2008-0095518 filed with the Korean Patent Office on September 29, 2008, and Korean Patent Application No. 10-2008-0035821 filed with the Korean Patent Office on April 17, 2008 And the rights and interests of Korean Patent Application No. 10-2008-0088469 filed to the Korean Patent Office on September 8, 2008, the disclosure of the above application is incorporated herein by reference in its entirety. Technical field [0002] The concept of the present invention relates to a semiconductor package, and more particularly, to a chip on film (COF) type semiconductor package in which the semiconductor package is attached to a flexible film. In addition, the concept of the present invention relates to a belt for heat-dissipating parts, which is capable of conveying heat-dissipating parts. In addition, the concept of the present invention relates to an electronic device including a COF type semiconductor package. Backgroun...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/14H01L23/28G02F1/133
CPCH01L2924/0002H01L2224/73204H01L2224/16225H01L2224/32225
Inventor 崔敬世金秉瑞赵京淳周永宰郑礼贞李相熺孙大雨赵相贵河政圭赵暎相
Owner SAMSUNG ELECTRONICS CO LTD