External connection heat radiation cap encapsulation structure of positive installation locking hole heat radiation block projected post of base island exposed chip

Abstract

The invention relates to an external connection heat radiation cap encapsulation structure of a positive installation locking hole heat radiation block projected post of a base island exposed chip, which comprises a chip (3), a metal base island (1), a metal inner pin (4), a metal wire (5), a first conductive or nonconductive heat-conductive adhesive material (2) and a plastic encapsulation body (8), wherein the metal base island (1) is exposed out of the plastic encapsulation body (8), a heat radiation block (7) is arranged above the chip (3), the heat radiation block (7) is provided with a locking hole (7.1), a second conductive or nonconductive heat-conductive adhesive material (6) is embedded and arranged between the heat radiation block (7) and the chip (3), a heat radiation cap (11) is arranged above the heat radiation block (7), the heat radiation cap (11) is in insertion connection with the heat radiation block (7) through a projected post (11.1), a third conductive or nonconductive heat-conductive adhesive material (13) is in embedded arrangement, and the heat radiation cap (11) is sheathed on the plastic encapsulation body (8). The encapsulation structure of the invention can provide strong heat radiation capability.

Description

(1) Technical field [0001] The invention relates to a packaging structure of a base island exposing a chip and mounting a locking hole of a heat dissipation block protruding column externally connected with a heat dissipation cap. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective ...

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