Device for improving transmission bandwidth

A technology of transmission bandwidth and signal transmission line, which is applied in connection devices, waveguide-type devices, electrical components, etc., and can solve problems such as transmission bandwidth limitation and discontinuous transmission channel impedance.

Active Publication Date: 2010-08-04
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Since the gold wire (WireBonding) presents certain inductive characteristics, the impedanc

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  • Device for improving transmission bandwidth
  • Device for improving transmission bandwidth
  • Device for improving transmission bandwidth

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] like figure 1 The illustrated embodiment of the present invention provides a device for improving transmission bandwidth, including: a signal transmission line 1, side grounds 2 located on both sides of the signal transmission line 1, and side grounds 2 arranged between the signal transmission line 1 and the side grounds. Capacitor 3 between 2.

[0022] In an embodiment of the present invention, the signal transmission line may be a microstrip line, and the...

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Abstract

The embodiment of the invention discloses a device for improving the transmission bandwidth. The device comprises a signal transmission line, lateral rimlands positioned at two sides of the signal transmission line and capacitors arranged between the signal transmission line and the lateral rimlands, wherein the signal transmission line is a microstrip line; and the signal transmission line and the lateral rimlands commonly form a mode of coplanar waveguide transmission line. On a transmission channel connected through wire bonding, the capacitors are arranged between the signal transmission line and the lateral rimlands, and a resonance point in the frequency band is formed on a frequency domain by using the perception characteristic shown by the wire bonding and an LC resonance circuit consisting of the wire bonding and the capacitors connected with the wire bonding in parallel, so that the rising trend of a return loss curve is forced to be postponed, the frequency bandwidth can be expanded, and the bandwidth of the transmission channel of the RF signals can be expanded.

Description

technical field [0001] The invention relates to the technical field of electronic communication, in particular to a device for improving transmission bandwidth. Background technique [0002] Existing optoelectronic devices, such as TOSA (Transmitter Optical Sub-Assembly, Transmitter Optical Sub-Assembly) photoelectric conversion module, in which the substrate and package shell are connected by gold wire (Wire Bonding) to realize signal transmission. [0003] In the process of realizing the present invention, the inventor finds that the prior art has at least the following disadvantages: [0004] Since the gold wire (Wire Bonding) exhibits certain inductance characteristics, the impedance of the transmission channel is discontinuous, and the transmission bandwidth is greatly limited. Contents of the invention [0005] The embodiment of the present invention provides a device for increasing the transmission bandwidth, which is installed on the transmission channel connected...

Claims

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Application Information

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IPC IPC(8): H01P3/08
CPCH01P3/003H01P5/028
Inventor 胡立辉杨睿程诗平
Owner HUAWEI TECH CO LTD
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