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Copper-infiltrated furnace for preparing tungsten-copper compound material

A technology of copper infiltration and copper furnace, which is applied in the field of composite material preparation equipment, can solve the problems of low density, waste of time and low efficiency of tungsten-copper alloy

Active Publication Date: 2012-08-22
安泰天龙钨钼科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method also requires the cooling of the copper infiltration furnace to cool the tungsten-copper alloy blank out of the furnace, that is, the intermittent production of tungsten-copper composite materials from one furnace to another, which not only wastes time and causes low efficiency, but also wastes energy by repeated heating of copper, etc. and resources
[0005] In short, the density of the tungsten-copper alloy produced by the direct sintering method is relatively low, and the push boat infiltration method is prone to uneven copper infiltration, and the high-quality tungsten-copper alloy produced by the liquid copper infiltration method needs to be produced batch by furnace.
Various methods cannot meet the current production needs of tungsten-copper alloys

Method used

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  • Copper-infiltrated furnace for preparing tungsten-copper compound material
  • Copper-infiltrated furnace for preparing tungsten-copper compound material
  • Copper-infiltrated furnace for preparing tungsten-copper compound material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] A tungsten-copper alloy comprises the following components and contents (weight): 85% tungsten and 15% copper. Its preparation process comprises the following steps:

[0074] (1) Powder preparation

[0075] Take tungsten powder with a purity of ≥99.95% and an average Fischer particle size of 3-8 microns, and electrolytic copper powder with a purity of ≥99.95% and an average particle size of -300 mesh for use.

[0076] (2) Mixing

[0077] Using the tungsten powder in step (1), without adding electrolytic copper powder as an inducer, stirring evenly on a powder mixer.

[0078] (3) Compression molding

[0079] The mixture processed in step (2) is placed in a mold corresponding to the predetermined shape, and pressed and formed on a press, and the pressure of the press is 180MPa;

[0080] (4) pre-burning

[0081] The tungsten-copper green body pressed and formed in step (3) is sintered in a hydrogen-molybdenum wire furnace at 1500°C, and kept for 75 minutes to obtain a...

Embodiment 2

[0085] A tungsten-copper alloy comprises the following components and content (weight): 80% tungsten and 20% copper. Its preparation process comprises the following steps:

[0086] (1) Powder preparation

[0087] Take tungsten powder with a purity of ≥99.95% and an average Fischer particle size of 3-8 microns, and electrolytic copper powder with a purity of ≥99.95% and an average particle size of -300 mesh for use.

[0088] (2) Add inducer and mixture

[0089] The above-mentioned tungsten powder and electrolytic copper powder (as inducer) are uniformly mixed on a powder mixer, wherein the addition of electrolytic copper powder accounts for 2% of the total weight of the tungsten-copper alloy, and the addition of tungsten powder accounts for 2% of the total weight of the tungsten-copper alloy. 80%.

[0090] (3) Compression molding

[0091] The mixed material processed in step (2) is placed in a mold corresponding to the predetermined shape, and pressed and formed on a press, a...

Embodiment 3

[0097] A tungsten-copper alloy comprises the following components and content (weight): 75% of tungsten and 25% of copper. Its preparation process comprises the following steps:

[0098] (1) Powder preparation

[0099] Take tungsten powder with a purity of ≥99.95% and an average Fischer particle size of 3-8 microns, and electrolytic copper powder with a purity of ≥99.95% and an average particle size of -300 mesh for use.

[0100] (2) Add inducer and mixture

[0101] The above-mentioned tungsten powder and electrolytic copper powder (as inducer) are uniformly mixed on a powder mixer, wherein the addition of electrolytic copper powder accounts for 6% of the total weight of the tungsten-copper alloy, and the addition of tungsten powder accounts for 10% of the total weight of the tungsten-copper alloy. 75%.

[0102] (3) Compression molding

[0103] The mixture processed in step (2) is placed in a mold corresponding to the predetermined shape, and pressed and formed on a press,...

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Abstract

The invention relates to a copper-infiltrated furnace for preparing a tungsten-copper compound material and a copper-infiltrated process using the same. In particular, the invention relates to the copper-infiltrated furnace, and the copper-infiltrated furnace comprises a feed and discharging furnace body, a copper-infiltrated furnace body, a charging basket and a charging basket conveyer system, wherein the copper-infiltrated furnace body is communicated with the feed and discharging furnace body by supporting the opening of a furnace door; the charging basket conveyer system comprises a pushing device and a lifting device; the charging basket is provided with a cavity and a connecting part, and the cavity is used for accommodating blanks to be infiltrated with copper and products infiltrated with the copper; and the connecting part is connected with the lifting device.

Description

technical field [0001] The invention relates to a device for preparing composite materials. Specifically, the present invention relates to a copper infiltration furnace for preparing tungsten-copper composite materials. Background technique [0002] Tungsten-copper composite material combines high hardness, low expansion coefficient and high temperature resistance of tungsten with high electrical conductivity, thermal conductivity and good plasticity of copper. Therefore, it is widely used in cathode materials in the field of high-voltage electrical appliances in power electronics, electrode materials for resistance welding, EDM plasma heating, and other fields, such as ray targets, high specific gravity alloys, rocket nozzles, aircraft throat linings, etc. Military materials and integrated circuit lead frames, heat sink substrate materials, etc. [0003] Tungsten copper series composite materials mainly include CuW60, CuW70, CuW80, CuW90. At present, the methods for prep...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C27/04
Inventor 苏国军苏国平刘俊海王峥
Owner 安泰天龙钨钼科技有限公司