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Back plate and back plate communication system

A communication system and backplane technology, which is applied in the field of communication, can solve the problems of increasing the cost of the backplane and limited area of ​​the backplane, and achieve the effects of reducing the cost of the backplane, increasing the wiring density, and reducing the quantity

Active Publication Date: 2012-11-07
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Due to the limited area of ​​the backplane, especially in the area where the pins of the slots are concentrated, in order to prevent the pins of each slot from intersecting with the connection lines of other slots, it is necessary to use multiple wiring layers to isolate each connection line to different levels. plane layer, which increases the cost of the backplane

Method used

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  • Back plate and back plate communication system
  • Back plate and back plate communication system
  • Back plate and back plate communication system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A backplane, the backplane includes at least two service slots with the same function and a crossover slot, and among the pins connected to the crossover slots of different service slots with the same function, at least two pins are stepped shape arrangement.

[0028] In the prior art, the pins of the service slots with the same function connected to the cross slots are arranged in the same position. In the embodiment of the present invention, by changing the position of the pins, for example, the figure 1 The signal corresponding to the position of pin B on the middle service slot L1 is connected to the position of pin E. Ladder-like arrangement can adjust the distribution and direction of the corresponding connection lines, so that the connection lines between the business slots and the cross slots can be staggered with fewer wiring layers, increasing the wiring density in a single wiring layer, reducing The number of routing layers used.

[0029] Ladder arrangement...

Embodiment 2

[0038] When the service slots with the same function and the cross-connect slots are in the same row on the backplane, the pins connected to the cross-connect slots on the service slots with the same function are arranged as follows:

[0039] At least two pins connected to the crossover slots with the same function are located at the n+qth position in the same column of each service slot, and q is the hysteresis position number of the first pin connected to the crossover slot, The first pin connected to the crossover slot is located on the service slot with the smallest n, where n is the difference between m and d, m is the total number of service slots with the same function on one side of the crossover slot, and d is the service slot The number of service slots with the same function separated from the cross slots, n and m are positive integers, d and q are integers not less than 0.

[0040] The number of hysteresis positions refers to the fixed value of the movement of the ...

Embodiment 3

[0049] In the case where the service slots with the same function and the cross-connect slots in Embodiment 2 are in the same row, and there are two pins connected to the cross-connect slots in the same column on a single service slot on the backplane, then the nth pin with the same function The two pins in the same column connected to the cross slot on the service slot are arranged at intervals of n-1 positions, and the meaning of n is the same as above.

[0050] For example, on the service slot of n=2, two pins in the same column connected to the cross slot are arranged at an interval of n-1=2-1=1 positions. Such as Figure 4 As shown, the signals a and b are used to connect the cross-connect slots, and the pins connected to different service slots on the cross-connect slot are named 1a, 2a, 3a, and 4a respectively. There are 4 pins on one side of the cross-connect slot. For example, two service slots with the same function, the service slots and the cross-connect slots are...

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Abstract

The embodiment of the invention discloses a back plate and a back plate communication system, wherein the back plate comprises at least two service trenches with the same function and cross trenches, and in the pins of the different service trenches with the same function respectively connected with the cross trenches, at least two pins are arranged in a stepped shape. Because in the pins of the service trenches with the same function respectively connected with the cross trenches, at least two pins are arranged in the stepped shape, the distribution and the trend of the connecting lines of the pin of each service trench with the same function connected with the cross trenches can be adjusted, and the wiring density in a single wiring layer is improved, so that the connecting lines between each service trench and the cross trenches can be staggered in fewer wiring layers and even one wiring layer, the use quantity of the wiring layers is reduced, and the cost of the back plate is lowered.

Description

technical field [0001] The invention relates to the communication field, in particular to a backplane and a backplane communication system. Background technique [0002] The backplane is an important part of communication equipment, which provides electrical signal connection and physical support for each single board and module of communication equipment. The backplane is composed of multi-layer printed boards, connectors, etc., and generally contains multiple slots with different functions. , each board is inserted into the slot to provide services. [0003] The layout of the backplane slot pins that interface with the board is called the backplane PINMAP. This pin layout directly affects the interface design of the board and the backplane, and determines the wiring scheme of the backplane. [0004] The arrangement of the pins of the service slots with the same function on the backplane is generally consistent, and on the same wiring layer, the connection lines between th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04Q1/02
CPCH04Q1/155
Inventor 王辉邓治高于涛邓倩徐华曹美汉
Owner HUAWEI TECH CO LTD