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Main board and system for memory mounting test

一种安装测试、存储器的技术，应用在静态存储器、单个半导体器件测试、半导体/固态器件测试/测量等方向，能够解决存储器模块增加时间和成本等问题

Inactive Publication Date: 2010-10-13
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such installation testing of relatively high-capacity memory modules at the system level requires increased time and cost

Method used

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  • Main board and system for memory mounting test
  • Main board and system for memory mounting test
  • Main board and system for memory mounting test

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Embodiment Construction

[0026] Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings. It should be understood, however, that the inventive concepts may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Furthermore, only non-limiting examples are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Throughout this application, the same reference numerals denote the same elements.

[0027] It will be understood that, although the terms first, second etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. For example, a first element could be termed a second element, and similarly, a second element could be termed a first element, without departing from the inventive concept...

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Abstract

The invention discloses a main board and system for memory mounting test. The main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a smaller space, because the memory module is connected to the main board in a direction parallel to the main board.

Description

[0001] This application claims priority from Korean Patent Application No. 2009-0028027 filed with the Korean Intellectual Property Office (KIPO) on Apr. 1, 2009, the contents of which are hereby incorporated by reference in their entirety. technical field [0002] Exemplary embodiments relate to a memory test system, for example, a main board for a memory mount test and a memory mount test system having the same. Background technique [0003] The test of the semiconductor device may be performed by connecting the semiconductor device to automatic test equipment (ATE), applying a predetermined signal pattern to the semiconductor device, and analyzing an output signal of the semiconductor device. As the capacity and operating speed of semiconductor devices increase, the cost for testing semiconductor devices also increases. Accurate testing of semiconductor devices is relatively difficult because the testing is performed not under real use conditions but under specially desig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C29/56G06F1/16
CPCG11C5/04G11C29/56016G11C29/56G11C2029/5602G01R31/26G11C29/00H01L22/00
Inventor 李廷国李成熙
Owner SAMSUNG ELECTRONICS CO LTD