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Two-layer circuit board structure for capacitive touch pad and manufacturing method thereof

A technology of capacitive touch and manufacturing method, which is applied in the fields of printed circuit parts, conductive pattern formation, electrical digital data processing, etc., and can solve the problems of induced voltage drop, high cross-bridge resistance, and reduced induction sensitivity, etc.

Inactive Publication Date: 2012-07-04
ELAN MICROELECTRONICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cross-bridge resistance of the carbon ink wire 20 is relatively high, and the series connection resistance formed causes a drop in the induced voltage, thus reducing the inductive sensitivity

Method used

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  • Two-layer circuit board structure for capacitive touch pad and manufacturing method thereof
  • Two-layer circuit board structure for capacitive touch pad and manufacturing method thereof
  • Two-layer circuit board structure for capacitive touch pad and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0036] In one embodiment of the present invention, as Figure 4 As shown, the structure of the two-layer circuit board used for the capacitive touch panel is similar to the known technology, and the same conductive layer is used to make a plurality of first sensing pads 16, a plurality of second sensing pads 19 and a plurality of connecting lines 17 to connect all The plurality of first sensing pads 16 are connected in groups to form a plurality of sensing lines in the first direction, the plurality of first sensing pads 16 and the plurality of second sensing pads 19 are arranged in a first matrix, and the plurality of second sensing pads 19 are arranged in a first matrix. The sensing pads 19 are separated from each other and not connected. However, the green paint 32 of the circuit board is not completely removed, and still covers the conductive layer. Each bridging region 195 is between two adjacent second sensing pads 19, exposing the two adjacent second sensing pads 19. P...

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PUM

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Abstract

The invention relates to a two-layer circuit board structure for a capacitive touch pad and a manufacturing method thereof. The two-layer circuit board structure for the capacitive touch pad comprises a substrate layer, wherein a plurality of first induction pads and a plurality of second induction pads are arranged on the substrate layer; the plurality of first induction pads are in group connection by a plurality of connecting lines so as to form a plurality of induction lines in a first direction; the plurality of second induction pads are in group connection by a plurality of bridging lines so as to form a plurality of induction lines in a second direction; and the plurality of bridging lines are formed by coating, so the resistance is low and the manufacturing cost is low.

Description

technical field [0001] The present invention relates to a capacitive touch panel, in particular to a two-layer circuit board structure for a capacitive touch panel and a manufacturing method thereof. Background technique [0002] The traditional capacitive touch panel uses a four-layer printed circuit board, and its X-axis and Y-axis sensing lines are made of different layers of conductors. In order to reduce the cost, a two-layer circuit board structure has been developed, and the induction lines of the X-axis and Y-axis are made of the same layer of conductors. Such as figure 1 As shown, the sensing pads 16 of the X-axis are connected by connecting wires 17 to form an X-axis sensing line, and the connecting wires 17 are also made of conductors of the same layer. But the sensing pads 19 of the Y axis are separated by the sensing lines of the X axis, so they are not connected to each other. One way to connect the Y-axis sensing pads 19 to form the Y-axis sensing lines is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/044H05K1/02H05K3/10
Inventor 黄世峰
Owner ELAN MICROELECTRONICS CORPORATION