The invention discloses a gold spraying solder without lead , the preparation method and application of the gold spraying solder. According to the weight, the components of the gold spraying solder are divided into the following: Cu: 0.01- 0.5, Ni: 0.001-0.5, P: 0.001-0.1,Er: 0.001-0.5, In:0.001 -0.5, Bi: 0.075-5, Sb:0.01-2.5,Sn: 49-71, and the rest is Zn whose shares can be added with others to 100 shares. The invention has good anti-oxidation property, good wettability and high mechanical intensity, and the creep resistance and the electrical properties are better than that of lead motogo element gold spraying solder and that of products alike.