Liquid resin composition for electronic component and electronic component device

A technology for resin compositions and electronic components, which is applied in the fields of electrical components, electric solid devices, semiconductor/solid device components, etc., can solve the problems of high-purity liquid resin compositions that are difficult to adapt to, and achieves low water absorption and adhesive properties. Good viscosity and good migration resistance

Active Publication Date: 2010-10-06
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for example, in COF (Chip On Film), which is a typical semiconductor device with remarkable line thinning and narrow pitch, further improvement of migration resistance is required, and it is difficult to achieve high purity of the liquid resin composition for electronic parts only. adapt

Method used

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  • Liquid resin composition for electronic component and electronic component device
  • Liquid resin composition for electronic component and electronic component device
  • Liquid resin composition for electronic component and electronic component device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5

[0109] (Examples 1 to 5 and Comparative Example)

[0110] (A) as epoxy resin

[0111] Bisphenol F type liquid epoxy resin with an epoxy equivalent of 160 (trade name YDF-8170C manufactured by Tohto Chemical Co., Ltd.),

[0112] Naphthalene-type epoxy resin with an epoxy equivalent of 140 (trade name HP-4032 manufactured by Dainippon Ink Industry Co., Ltd.),

[0113] as a rubber particle component

[0114] Make acrylonitrile-butadiene-methacrylic acid-divinylbenzene copolymer (trade name XER-91P manufactured by JSR Corporation) in bisphenol F type liquid epoxy resin (YDF-8170C) at a mass ratio of 1 / 4 The rubber-modified epoxy resin that has been heat-miscible and micro-dispersed in advance,

[0115] as leveling agent

[0116] Phenol-modified silicone with a hydroxyl equivalent of 750 (trade name BY16-799 manufactured by Toray Dow Corning Silicone Co., Ltd.) and bisphenol F-type liquid epoxy resin (YDF-8170C) are heated and mixed at a mass ratio of 1 / 1 The obtained silicon...

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Abstract

The invention provides a liquid resin composition for an electronic component and an electronic component device sealed by the liquid resin composition, wherein the liquid resin composition has good transference resistance, other formability and excellent reliability. The invention is characterized in that the resin composition for the electronic component is the liquid resin composition including (A) epoxy resin, (B) normal temperature liquid circular acid anhydride, (C) coupling agent and (D) anti-oxidant.

Description

technical field [0001] The present invention relates to a liquid resin composition for electronic components suitable for sealing electronic components, and an electronic component device sealed by the same. Background technique [0002] Currently, in the field of element sealing for electronic component devices such as transistors and ICs, resin sealing has become the mainstream from the viewpoints of productivity and cost, and epoxy resin compositions have been widely used. The reason for this is that epoxy resins are balanced in properties such as handleability, moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to inserts. Liquid resin compositions for electronic parts are widely used as sealing materials in semiconductor devices mounted on bare chips such as COB (Chjpon Board), COG (Chip on Glass), and TCP (Tape Carrier Package). In recent years, as a method of mounting ICs for driving displays such as liqu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08K13/02C08K5/5435C08K5/13C08K5/134C08K5/17C08K5/3445C08K3/36C08G59/42H01L23/29
CPCC08G59/62C08K5/09C08K5/13C08K13/02C08L63/00H01L23/29H01L23/31H05K3/28
Inventor 高桥寿登太田浩司
Owner 株式会社力森诺科
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