Cu-Al alloy powder, alloy paste utilizing same, and electronic component

Abstract

Disclosed is an electronic component wherein wiring and electrodes are produced by baking a paste, and which has wiring that connects to a glass or glass ceramic member. The electronic component can suppress an increase in electrical resistance resulting from oxidation, can suppress the generation of air bubbles in the glass or glass ceramic, and uses a Cu wiring material with excellent migration resistance. Further disclosed is a Cu-Al alloy powder that comprises Cu and preferably no more than 50 mass % of Al, and that is characterized by the surface of the aforementioned Cu-Al alloy powder being covered by an Al oxide coat layer with a thickness of no more than 80 nm. This powder is combined with a glass or a glass ceramic material to form a paste, and can be used to form wiring, electrodes, and / or contact members.

Description

technical field [0001] The present invention relates to a copper-based wiring, electrode and / or contact wiring material capable of suppressing oxidation of wiring materials in the manufacture of wiring, electrodes and / or contacts, and an electronic component using the same for wiring. Background technique [0002] Electronic components with wiring, electrodes, and / or contacts, etc., are manufactured using a manufacturing process that does not come into contact with an oxidizing atmosphere, as represented by LSI wiring, pure Cu can be used as wiring or electrode materials . On the other hand, as used in a typical manufacturing process such as a large plasma display device, metal wiring is buried in a glass dielectric, and in the manufacturing process, it is carried out in an oxidizing atmosphere, for example, at a high temperature range of 400°C or higher. heat treatment. [0003] In addition, in an electrode for a solar cell, heat treatment (baking) is performed in an atmo...

AI Technical Summary

Problems solved by technology

However, it is pointed out that when one or more elements selected from the group consisting of Al, Au, Ag, Ti, Ni, Co, and Si are added to this alloy in a total of 3.0 wt% or more, the weather resistance deteriorates on the contrary.

In addition, there is a problem that since the addition of Mo is necessary, the material cost increases, so it is not suitable for electronic parts products with low market cost.

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