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Silver powder surface modification processing method

A technology of surface modification and treatment method, applied in the direction of coating, etc., can solve the problem of ion migration of silver conductor paste, etc., and achieve the effect of smooth surface, short time and high efficiency

Inactive Publication Date: 2010-02-24
南京金视显科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the problem of ion migration of silver conductor paste, and provide a method for surface modification of silver powder, that is, to use a coating machine to coat one or several other nanoparticles on the surface of silver powder

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Example 1. Weigh 18.18g of silver powder with an average particle size of 10nm and 181.82g of silver powder with an average particle size of 1μm, and pour (10:100) into the sample tank of the coating machine. figure 1 The left is the No. 1 blade, the right is the No. 2 blade, Figure 2-4 Corresponding to No. 3-5 cutter heads respectively. Select the No. 5 and No. 3 cutter heads for assembly, adjust the coating machine speed to 5000r / min, the revolution speed to 30r / min, and the operation time to 3min. Start the operation. After the end, pour out the silver powder. Either shuttle-shaped or superimposed up and down with the annular blade and rotates together. The revolution is provided by the cladding machine itself.

[0021] 65% (weight ratio) of the above-mentioned modified silver powder, 5% of black lead-free glass powder, 5% of photosensitive monomer, 5% of photoinitiator, and 20% of organic carrier are dispersed and mixed uniformly. After the material is printed,...

Embodiment 2

[0022] Example 2. Weigh 1.00 g of copper powder with an average particle size of 20 nm and 199.00 g of silver powder with an average particle size of 1 μm

[0023] (1:100), pour it into the sample tank of the coating machine, select the No. 3 cutter head and the No. 4 cutter head to assemble, adjust the mixing knife speed of the coating machine to 10000r / min, the revolution speed of the sample tank to 30r / min, and the running time is 2.5min, start running, after the end, pour out the silver powder.

[0024] 65% (weight ratio) of the above-mentioned modified silver powder, 5% of black lead-free glass powder, 5% of photosensitive monomer, 5% of photoinitiator, and 20% of organic carrier are dispersed and mixed uniformly. After the material is printed, dried and sintered, the test is carried out. The test results are shown in Table 1.

Embodiment 3

[0025] Example 3. Weigh 2.96g of nickel powder with an average particle size of 40nm and 197.04g of silver powder with an average particle size of 5μm

[0026] (1.5∶100), pour it into the sample tank of the coating machine, select the No. 5 shuttle cutter head and the No. 3 cutter head to assemble, adjust the coating machine speed to 14000r / min, revolution speed to 30r / min, and run time to 30s. Start the operation, and after the end, pour out the silver powder.

[0027] 65% (weight ratio) of the above-mentioned modified silver powder, 5% of black lead-free glass powder, 5% of photosensitive monomer, 5% of photoinitiator, and 20% of organic carrier are dispersed and mixed uniformly. After the material is printed, dried and sintered, the test is carried out. The test results are shown in Table 1.

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Abstract

The invention relates to a silver powder surface modification processing method. Nano-particles are wrapped by a wrapping machine and embedded into the micron-silver hole on the micron-silver surface.The nano-particles can be nano-silver powder, nano-Cu powder, nano-Al powder, nano-Sn powder, nano-Zn powder, nano-Ni powder or nano-In powder. The grain diameter of the nano-particles is 10-50 nanometers, and the grain diameter of the micron-particles is from 1-5 microns. The mass ratio of nano-particles to micron-particles is 1:100 to 15:100. The time of treatment by the wrapping machine is 30sto 3min.

Description

technical field [0001] The invention relates to a method for surface treatment of silver powder, and the prepared silver powder can be used as the main material of electronic paste for components in the electronic industry. Background technique [0002] With the development of the times, conductive pastes are widely used in the electronics industry, and silver pastes are more commonly used in conductive pastes. However, there are some disadvantages in the use of silver paste. For example, ion migration is easy to occur under the action of an external electric field, resulting in a short service life of electronic components. The reasons for ion migration are the morphology, particle size, uniformity, etc. of the silver powder, but the most important reason is the characteristics of the silver powder itself, so the surface of the silver powder should be modified. [0003] Patent Publication No. CN 1202531C discloses a low-content silver conductive paste. This method introdu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02
Inventor 申桂侠沈仙林徐建立林保平
Owner 南京金视显科技有限公司
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