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Leadless gold-spraying solder and its preparation method and application

A technology of lead-free spraying gold and solder, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of lead poisoning, insufficient performance, lead poisoning, etc., to reduce copper concentration difference, Effect of increasing melting temperature and improving wettability

Inactive Publication Date: 2008-01-16
广东中实金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional gold spray materials are generally lead-based alloy materials, such as Sn35PbSbZn, Sn30PbSbZn, Sn28PbSbZn, Sn38PbSbZnBi and other lead-based quaternary or lead-based five-component gold spray materials. This gold spray material contains more lead, with a lead content of 57%. -65%, but lead is poisonous. When waste electronic appliances are disposed of in landfill, Pb in solder will meet acid rain or groundwater to form Pb 2+ , soluble in groundwater, entering people's water supply chain and thus entering the human body, leading to lead poisoning; and the combination of raw materials of the current lead-free gold spray materials cannot overcome the inherent defects of the raw material performance itself, and the performance is not superior enough

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1 lead-free gold-sprayed solder

[0027] Raw materials (kg): Cu0.01, Ni0.01, P0.001, Er0.003, In0.005, Bi0.1, Sb0.05, Sn60, Zn39.821.

[0028] Preparation method: Melt the mixed salt of potassium chloride:lithium chloride at 1.6:1.2 at 500°C according to the weight ratio, and pour an appropriate amount on the weighed tin; raise the temperature to 700°C, and after the tin is melted, pour Add the weighed copper, nickel, indium, bismuth, and antimony into the molten tin liquid, stir to form an alloy; Press into the above molten alloy and turn the bell jar; after the P element and rare earth Er are completely melted, then add the weighed Zn into the molten alloy and stir. After the Zn is completely melted, keep it warm for 1.5 hours, stir to make the alloy homogeneous, leave the furnace to stand, and remove the mixed salt on the surface after solidification.

Embodiment 2

[0029] Embodiment 2 lead-free gold-sprayed solder

[0030] Raw materials (kg): Cu0.05, Ni0.5, P0.003, Er0.001, In0.001, Bi0.15, Sb1.1, Sn49, Zn49.195.

[0031]Preparation method: Melt the mixed salt of potassium chloride:lithium chloride in a ratio of 1:1.2 at 450°C according to the weight ratio, and pour an appropriate amount on the weighed tin; raise the temperature to 600°C, and after the tin is melted, pour Add the weighed copper, nickel, indium, bismuth, and antimony into the molten tin liquid, stir to form an alloy; Press into the above molten alloy and turn the bell jar; after the P element and rare earth Er are completely melted, then add the weighed Zn into the molten alloy and stir. After the Zn is completely melted, keep it warm for 1 hour, stir to make the alloy homogeneous, leave the furnace to stand, and remove the mixed salt on the surface after solidification.

Embodiment 3

[0032] Embodiment 3 lead-free gold-sprayed solder

[0033] Raw materials (kg): Cu0.5, Ni0.5, P0.1, Er0.5, In0.005, Bi2, Sb2, Sn71, Zn23.395.

[0034] Preparation method: Melt the mixed salt of potassium chloride:lithium chloride at 1.6:0.8 at 550°C according to the weight ratio, and pour an appropriate amount on the weighed tin; raise the temperature to 800°C, and after the tin is melted, pour Add the weighed copper, nickel, indium, bismuth, and antimony into the molten tin liquid, stir to form an alloy; Press into the above molten alloy and turn the bell jar; after the P element and rare earth Er are completely melted, then add the weighed Zn into the molten alloy and stir. After the Zn is completely melted, keep it warm for 2 hours, stir to make the alloy homogeneous, leave it to stand out of the furnace, and remove the mixed salt on the surface after solidification.

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PUM

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Abstract

The invention discloses a gold spraying solder without lead , the preparation method and application of the gold spraying solder. According to the weight, the components of the gold spraying solder are divided into the following: Cu: 0.01- 0.5, Ni: 0.001-0.5, P: 0.001-0.1,Er: 0.001-0.5, In:0.001 -0.5, Bi: 0.075-5, Sb:0.01-2.5,Sn: 49-71, and the rest is Zn whose shares can be added with others to 100 shares. The invention has good anti-oxidation property, good wettability and high mechanical intensity, and the creep resistance and the electrical properties are better than that of lead motogo element gold spraying solder and that of products alike.

Description

technical field [0001] The invention relates to spraying solder, in particular to a lead-free gold-spraying solder and its preparation method and application, in particular to the technical field of lead-free tin-based multi-element alloy material used for spraying the end face of metallized polyester film capacitors in electrical discrete devices. Background technique [0002] Traditional gold spray materials are generally lead-based alloy materials, such as Sn35PbSbZn, Sn30PbSbZn, Sn28PbSbZn, Sn38PbSbZnBi and other lead-based quaternary or lead-based five-component gold spray materials. This gold spray material contains more lead, with a lead content of 57%. -65%, but lead is poisonous. When waste electronic appliances are disposed of in landfill, Pb in solder will meet acid rain or groundwater to form Pb 2+ , soluble in groundwater, entering people's water supply chain and thus entering the human body, leading to lead poisoning; and the combination of raw materials of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/26B23K35/28C22C1/02
Inventor 丁飞黄云海李云丁继义王致岭黄焱杨笔毫仵桂德刘力萍陈国民葛立良张建民冯敏孟广寿张树谦李峰
Owner 广东中实金属有限公司
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