Apparatus and method for mounting electronic component

Abstract

An apparatus for mounting an electronic component is provided with first and second imaging cameras (43, 44) which pick up images of a panel and a TCP (3) at the time of mounting on a panel (1) the TCP transferred to a mounting position by an index table (4); an image processor, which aligns the panel with the TCP based on an imaging signal obtained from the imaging cameras, and at the same time,detects a shift quantity between an adhesive tape, which is cut to a prescribed length and adhered to the TCP, and the TCP; and a controller for controlling panel alignment performed by the panel table based on processing by the image processor, andrelative alignment of the TCP with the adhesive tape cut to the prescribed length.

Description

technical field [0001] The present invention relates to an electronic component mounting device and mounting method for mounting an electronic component such as TCP (Tape Carrier Package) on a substrate such as a glass panel used in a liquid crystal display device. Background technique [0002] For example, when manufacturing a liquid crystal display device, the mounting apparatus for mounting the said TCP which is an electronic component on the said panel which is a board|substrate is used. The above-mentioned TCP is punched out from a carrier tape using a die, and then supplied to a turntable that is rotationally driven intermittently at predetermined angles. A plurality of suction heads are provided in the circumferential direction on the turntable at intervals corresponding to each rotation angle. Then, the TCP punched out by the die is sequentially supplied to a plurality of suction heads. [0003] The said panel is positioned and mounted on the XY table, and is drive...

AI Technical Summary

Problems solved by technology

[0010]However, in As shown in FIG. 8A, when the adhesive tape 19 cut into a predetermined length is pasted on the TCP3 of the suction head 18 held on the turntable by suction, there is the following problem: The feeding accuracy of the release tape 20 of the tape 19, the elongation caused by changes in the temperature and humidity of the environment, or the positional deviation generated when the adhesive tape 19 is pushed up and pasted on the TCP3, etc., thus causing the above-mentioned adhesive tape 19 Generates an offset in the width direction of TCP3

[0012] In such a state, when the release tape 20 is peeled off from the adhesive tape 19 attached to the above-mentioned TCP3, such as Figure 8B before peeling off the release tape 20 from the adhesive tape 19, the adhesive tape 19 is peeled off from the TCP3 together with the release tape 20, that is, the so-called roll-up of the adhesive tape 19 occurs, so the TCP3 cannot be reliably mounted on the substrate.

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