Support for testing BGA packaged chips

Abstract

The invention provides a support for testing BGA packaged chips, belonging to the field of packaged chip testing. The support comprises a chip fixing frame, a probe fixing frame and test probes, wherein the chip fixing frame and the probe fixing frame are clamped; the test probes run through the probe fixing frame; one end of the test probes is connected with metal leads and the other end thereofis used for contacting welding spots of the chips; the chip fixing frame can not only fix the chips to be tested but also adjust the chip positions in the horizontal or upper and lower directions; and the probe fixing frame can adjust the area of a probe fixing block by adjusting push plates and further adjust the distance between the probes. Thus the support can not only conveniently realize testing the BGA packaged chips on a large scale but also carry out flexible adjustment and accurate matching and fixing according to the pin quantity and sizes of the chips to be tested and is suitable for the BGA packaged chips with various pin quantities and sizes.

Description

technical field [0001] The invention relates to the field of packaging chip testing, in particular to a BGA (Ball Grid Array, ball grid array) packaging chip testing support. Background technique [0002] BGA was developed in the 1990s with the advancement of integration technology, the improvement of equipment, and the use of deep submicron technology. A new packaging technology has emerged. Chips packaged with BGA technology can make the chip have smaller volume, better electrical performance, faster speed and better heat dissipation performance without changing the function. Now more and more chips are packaged in BGA . BGA packaged chips have a wide range of application requirements in embedded devices, portable devices and handheld computers. However, the number of pins of BGA packaged chips on the market, the distance between pins, and the package shape are different, so that users (especially those engaged in research or small-scale production users) when purchasin...

AI Technical Summary

Problems solved by technology

However, the number of pins of BGA packaged chips on the market, the distance between pins, and the package shape are different, so that users (especially those engaged in research or small-scale production users) when purchasing corresponding BGA packaged chips And before welding, it is impossible to test whether the chip is qualified by non-welding method. When there is a problem in the circuit board welding manufacturing process, it is impossible to locate whether it is a problem with the chip itself or a welding problem (because it is difficult to test whether the BGA package is welded or not with ordinary equipment and methods); There is no test device related to BGA packaged chips on the market, and there is no record of a BGA packaged chip test device that can be applicable to various pin numbers, distances between pins and package shapes in the prior art

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