Circuit board electrical performance detection method for assembly line

Abstract

The invention discloses a circuit board electrical performance detection method for an assembly line, and provides a solution for the problem of test point position offset. A sweep frequency detectiondevice needs to scan a fixed test point in the operation process of a circuit board substrate on the assembly line. In order to realize that a sample detection point position is static relative to the position of a resonance probe in the same period test radio frequency signal emission process, the invention provides a solution of a synchronous slide rail. The dielectric property and the loss ofthe circuit board substrate are obtained by performing microwave test on the circuit board substrate and combining a microwave network analyzer and an electrical property calculation module. The microwave resonance probe realizes scanning of the circuit board base material at the same point position in a fixed period through the synchronous slide rail so as to rapidly detect whether the electricalproperty of the product is qualified or not, and the method is beneficial to realizing large-batch test on the assembly line, is convenient and fast in structure installation and has relatively higher test efficiency.

Description

technical field [0001] The invention is applied in the field of circuit board production, and is mainly aimed at performing rapid and real-time microwave testing on the electrical properties of multi-batch products in the circuit board industrial production line. Background technique [0002] With the rapid development of electronic technology, the production demand of PCB printed circuit boards is also increasing. In order to realize the high-efficiency production of PCB printed circuit board production line, the demand for rapid test, real-time test and real-time feedback of circuit boards in industrial production is put forward. To reduce the test time of the circuit board production line and improve the overall production speed of the manufacturer. With the advent of the 5G era, there are new requirements for the production efficiency and testing methods of high-frequency circuit boards. [0003] At present, the mainstream detection method for the circuit board assembl...

AI Technical Summary

Problems solved by technology

This test method is only aimed at detecting physical defects on the surface of the circuit board, and cannot detect the material properties of the circuit board

The traditional bed of needles test method for the electrical performance of circuit boards needs to conduct contact discharge on the sample, which will affect the quality of the product during the contact process, and the test speed is slow

Images