Method for manufacturing a microelectronic package comprising at least one microelectronic device

A technology of microelectronic packaging and microelectronic devices, applied in the direction of electric solid state devices, electrical components, semiconductor devices, etc., to achieve the effect of increasing cost price, reducing cost price, and cheap manufacturing process
CN101919033BInactive Publication Date: 2011-11-23NXP BV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NXP BV
Publication Date
2011-11-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method for manufacturing a microelectronic package (1) comprises the steps of providing two parts (13, 14) comprising electrically insulating material such as plastic; providing members (21, 22, 23) comprising electrically conductive material; providing a microelectronic device (30); positioning the electrically conductive members (21, 22, 23) and the microelectronic device (30) on the electrically insulating parts (13, 14); and placing the electrically insulating parts (13, 14) against each other, wherein the microelectronic device (30) and portions of the electrically conductive members (21, 22, 23) are sandwiched between the electrically insulating parts (13, 14). The electrically conductive members (21, 22, 23) are intended to be used for realizing contact of the microelectronic device (30) arranged inside the package (1) to the external world. An important advantage of the method having steps as mentioned is that the electrically conductive members (21, 22, 23) as such are provided, wherein it is not necessary to provide a conventional lead frame which has the disadvantage of causing considerable waste of metal material during its manufacturing process.
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Description

technical field

[0001] The present invention relates to methods of fabricating microelectronic packages including at least one microelectronic device (eg, processor chip, transistor, sensor die, diode, light emitting diode (LED), etc.), and to microelectronic packages. Background technique

[0002] Microelectronic packages in which at least one microelectronic device is arranged are well known and various types of such packages have been developed. Among other things, encapsulation is used to protect the microelectronic device and to allow the microelectronic device to be easily connected to another device. Typically, microelectronic device dimensions are in the micrometer range and packages are in the millimeter range.

[0003] Typically, in order to support the microelectronic devices and to ensure the required robustness of the microelectronic package, a carrier substrate is provided to which the microelectronic devices are attached. In a typical embodiment of a microel...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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